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TM4C123BE6PZI7R

Texas Instruments

TM4C123BE6PZI7R by Texas Instruments

TM4C123BE6PZI7R by Texas Instruments is a 32-bit microcontroller with integrated cache, offering 131072 ROM words and 32768 RAM bytes. It has various peripherals like PWM(16), UART(8), and I2C(6), making it suitable for industrial applications requiring low power mode and high-speed connectivity.

Median Price

$7.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,191 parts In-Stock

1+ parts

$7.450

100+ parts

$6.074

1k+ parts

$4.049

10k+ parts

-

3,191

$7.450

$6.074

$4.049

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$6.559

100+ parts

-

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-

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81

$6.559

-

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Digiode

USA . 1,874 parts In-Stock

1+ parts

$7.078

100+ parts

-

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1,874

$7.078

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Vyrian

USA . 8,110 parts In-Stock

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-

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8,110

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Chip Stock

USA . 8,099 parts In-Stock

1+ parts

-

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8,099

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,114 parts In-Stock

1+ parts

$6.330

100+ parts

-

1k+ parts

-

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3,114

$6.330

-

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Continental Prestige Electronics

USA . 5,097 parts In-Stock

1+ parts

$6.559

100+ parts

-

1k+ parts

-

10k+ parts

$6.428

5,097

$6.559

-

-

$6.428

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$6.691

100+ parts

$6.691

1k+ parts

$6.691

10k+ parts

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1,000

$6.691

$6.691

$6.691

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Corphita

USA . 1,701 parts In-Stock

1+ parts

$6.705

100+ parts

-

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1,701

$6.705

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Microchip USA

USA . 1,670 parts In-Stock

1+ parts

$15.460

100+ parts

$15.240

1k+ parts

$15.130

10k+ parts

$15.020

1,670

$15.460

$15.240

$15.130

$15.020

AZTECH Wire

Italy . 183 parts In-Stock

1+ parts

$20.910

100+ parts

-

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183

$20.910

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Parana Technologies

USA . 1,216 parts In-Stock

1+ parts

$67.909

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1,216

$67.909

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DigiPath Technology Company

USA . 335 parts In-Stock

1+ parts

$74.776

100+ parts

$68.794

1k+ parts

-

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335

$74.776

$68.794

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ChromeModa Solutions

Germany . 2,971 parts In-Stock

1+ parts

$76.302

100+ parts

$62.568

1k+ parts

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2,971

$76.302

$62.568

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IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$76.302

100+ parts

$72.487

1k+ parts

$68.672

10k+ parts

-

2,265

$76.302

$72.487

$68.672

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Corohmni

South Africa . 1,224 parts In-Stock

1+ parts

$80.935

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1,224

$80.935

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Argo Parts USA

USA . 3,544 parts In-Stock

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3,544

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$6.428

1k+ parts

$6.231

10k+ parts

$6.100

100

-

$6.428

$6.231

$6.100

Overview

Experience the power of next-generation technology with the TM4C123BE6PZI7R by Texas Instruments. As a leader in microcontroller manufacturing, Texas Instruments delivers exceptional quality and reliability. This microcontroller offers limitless possibilities for applications in various industries. With its advanced features and integrated cache, it provides seamless performance and enhanced efficiency. Whether you're designing robotics, industrial automation, or consumer electronics, this microcontroller offers incredible value, benefits, and advantages. Unlock your creativity and bring your ideas to life with the TM4C123BE6PZI7R by Texas Instruments.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material ensures durability and protection for the microcontroller, making it a reliable choice for various applications.

Integrated Cache:

YES. The integrated cache enhances the microcontroller's performance by providing fast access to frequently used data, making it suitable for applications that require high-speed data processing.

Surface Mount:

YES. The surface mount feature allows for easy and efficient installation, making this microcontroller suitable for compact designs and mass production.

Maximum Supply Voltage:

1.32 V. The high maximum supply voltage provides flexibility in power supply options and allows for compatibility with a wide range of power sources.

On Chip Data RAM Width:

8. The wide data RAM width enables the microcontroller to handle and process larger amounts of data simultaneously, making it ideal for data-intensive applications.

Package Shape:

SQUARE. The square package shape offers a compact size, allowing for space-saving integration into various electronic devices and systems.

Bit Size:

32. The 32-bit architecture provides enhanced processing capabilities and supports complex algorithms and computations, making it a powerful choice for demanding applications.

No. of Terminals:

100. The ample number of terminals allows for versatile connectivity options, enabling the microcontroller to interface with various external components and peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH. This package style offers a low profile and fine pitch, making it suitable for applications with limited space requirements and high-density circuit designs.

Minimum Supply Voltage:

1.08 V. The low minimum supply voltage allows for energy-efficient operation and compatibility with low-power systems, making it an excellent choice for battery-powered applications.

Maximum Operating Temperature:

85 °C. The high maximum operating temperature ensures reliable performance in harsh environments with elevated temperatures, expanding the range of applications for this microcontroller.

CPU Family:

CORTEX-M4F. The Cortex-M4F CPU family offers advanced processing capabilities, including digital signal processing (DSP) instructions and floating-point calculations, making it suitable for applications requiring high computational power.

Minimum Operating Temperature:

40 °C. The low minimum operating temperature allows the microcontroller to function reliably in extreme cold conditions, making it suitable for use in temperature-sensitive environments.

Terminal Finish:

NICKEL PALLADIUM GOLD. The nickel palladium gold terminal finish provides corrosion resistance and excellent solderability, ensuring reliable electrical connections and long-term performance.

ADC Channels:

YES. The presence of ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for applications that require analog-to-digital conversion, such as sensor interfacing.

DMA Channels:

YES. The availability of DMA channels enables direct memory access, reducing the burden on the CPU and enhancing data transfer rates, making it suitable for high-speed data processing applications.

Terminal Position:

QUAD. The quad terminal position offers a secure and reliable connection, making it suitable for applications subject to vibrations or external forces.

ROM Words:

131072. The large ROM word capacity allows for the storage of extensive program code and data, accommodating complex applications and facilitating future expansions.

Maximum Seated Height:

1.6 mm. The low maximum seated height enables the microcontroller to be used in compact designs with tight height restrictions, ensuring compatibility with various form factors.

RAM Words:

32. The RAM word capacity provides a sufficient working memory space for temporary data storage and processing, making it suitable for applications with moderate memory requirements.

Width:

14 mm. The compact width dimension makes the microcontroller suitable for applications with space limitations and allows for integration into small form factor devices.

Data EEPROM Size:

2K. The EEPROM size of 2K provides non-volatile memory for storing critical data, allowing for data retention even when power is lost, making it suitable for applications requiring persistent data storage.

Boundary Scan:

YES. The presence of boundary scan capability enables efficient testing and debugging of the microcontroller during manufacturing and helps ensure product quality and reliability.

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2). The variety of peripherals offered allow for versatile functionality and enable the microcontroller to interface with a wide range of devices and systems, expanding its application possibilities.

Maximum Clock Frequency:

25 MHz. The high maximum clock frequency allows for fast execution of instructions, enabling rapid data processing and real-time operation in time-critical applications.

Maximum Time At Peak Reflow Temperature (s):

30. The microcontroller can withstand peak reflow temperatures for up to 30 seconds during the manufacturing process, ensuring proper soldering and reliability during assembly.

Peak Reflow Temperature °C:

260. The high peak reflow temperature tolerance enables the microcontroller to withstand the extreme temperatures experienced during the soldering process, ensuring successful assembly in manufacturing.

Length:

14 mm. The compact length dimension facilitates integration into space-constrained designs, making the microcontroller suitable for compact and portable devices.

Temperature Grade:

INDUSTRIAL. The industrial temperature grade allows the microcontroller to operate reliably in a wide range of temperatures typically encountered in industrial settings, ensuring stable performance and longevity.

Peripheral IC Type:

MICROCONTROLLER, RISC. The microcontroller utilizes a Reduced Instruction Set Computing (RISC) architecture, providing efficient and streamlined instruction execution, making it suitable for applications requiring fast and reliable processing.

No. of Timers:

12. The availability of multiple timers facilitates accurate timing coordination and synchronization of events, making it suitable for applications that require precise timekeeping or control functions.

RAM Bytes:

32768. The generous RAM byte capacity allows for ample workspace for data manipulation and storage, accommodating larger data sets and complex algorithms, making it suitable for memory-intensive applications.

Technology:

CMOS. The complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with various logic families, making it an energy-efficient and versatile choice.

Terminal Form:

GULL WING. The gull wing terminal form offers secure solder connections with ease of inspection, making it suitable for mass production and ensuring reliable electrical connections.

Analog To Digital Convertors:

22-Ch 12-Bit. The presence of 22 analog-to-digital converters with 12-bit resolution allows for precise and accurate conversion of analog signals into digital data, making it suitable for applications that require high-resolution analog measurements.

Maximum Supply Current:

54.9 mA. The maximum supply current represents the microcontroller's power consumption, and the low current value ensures energy-efficient operation, making it suitable for battery-powered or low-power applications.

Nominal Supply Voltage:

1.2 V. The nominal supply voltage represents the recommended operating voltage, ensuring compatibility with standard power sources and facilitating easy integration into existing systems.

No. of DMA Channels:

32. The availability of 32 direct memory access (DMA) channels allows for efficient data transfer and real-time communication with peripherals, reducing the processor's workload and enhancing overall system performance.

No. of Serial I/Os:

20. The plentiful number of serial inputs/outputs (I/Os) enables communication with a wide range of external devices and systems, accommodating versatile connectivity options.

PWM Channels:

YES. The presence of pulse-width modulation (PWM) channels allows for precise control of analog signals, making the microcontroller suitable for applications that require accurate speed control, power regulation, or analog signal manipulation.

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8). The microcontroller offers multiple connectivity options, including CAN, I2C, IRDA, MICROWIRE, SPI, SSI, and UART interfaces, enabling seamless integration with diverse communication protocols and peripheral devices.

ROM Programmability:

FLASH. The Flash programmability of the ROM allows for easy and efficient updating of the microcontroller's firmware, enabling flexibility and adaptability to changing application requirements.

Terminal Pitch:

0.5 mm. The small terminal pitch enables high-density packaging and allows for compact PCB layouts, making it suitable for applications with limited board space.

Format:

FLOATING POINT. The floating-point format allows for precise and accurate representation of fractional numbers, making the microcontroller suitable for applications that require complex mathematical calculations or high-precision data processing.

Moisture Sensitivity Level (MSL):

3. The MSL 3 rating indicates that the microcontroller has moderately sensitive moisture handling requirements during storage and assembly, ensuring longer shelf life and minimizing the risk of moisture-related damage.

Speed:

80 rpm. The speed rating of 80 rotations per minute (rpm) specifies the maximum rotational speed the microcontroller can handle, making it suitable for applications involving motor control or rotational systems.

Low Power Mode:

YES. The availability of a low power mode allows the microcontroller to operate in a reduced power state when not actively processing tasks, optimizing power consumption and prolonging battery life in energy-sensitive applications.

On Chip Program ROM Width:

8. The on-chip program ROM width of 8 allows for efficient storage and execution of program instructions, ensuring fast and reliable program execution in various applications.

No. of I/O Lines:

69. The ample number of input/output (I/O) lines enables flexible connectivity and interfacing with a wide range of external devices and peripherals, making it suitable for applications with extensive I/O requirements.

Technical Specifications

Microcontrollers TM4C123BE6PZI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

69

No. of Serial I/Os:

20

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8)

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C123BE6PZI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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