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TM4C123BE6PMI7R

Texas Instruments

TM4C123BE6PMI7R by Texas Instruments

TM4C123BE6PMI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 131072 ROM words, and 12 ADC channels. Ideal for industrial applications, it features 32 DMA channels, 16 PWM peripherals, and connectivity options like CAN, I2C, SPI, and USB. Operating temperature ranges from -40 to 85°C.

Median Price

$7.115

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,000 parts In-Stock

1+ parts

$7.115

100+ parts

$5.801

1k+ parts

$3.867

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6,000

$7.115

$5.801

$3.867

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$6.265

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10

$6.265

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Digiode

USA . 4,916 parts In-Stock

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$6.759

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4,916

$6.759

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Vyrian

USA . 6,197 parts In-Stock

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6,197

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,919 parts In-Stock

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$6.050

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$6.050

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Semicontronic

India . 5,732 parts In-Stock

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$6.050

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$5.899

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$5.868

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5,732

$6.050

$5.899

$5.868

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Continental Prestige Electronics

USA . 1,959 parts In-Stock

1+ parts

$6.265

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-

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$6.139

1,959

$6.265

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$6.139

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.390

100+ parts

$6.390

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$6.390

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500

$6.390

$6.390

$6.390

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Corphita

USA . 3,132 parts In-Stock

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$6.404

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AZTECH Wire

Italy . 573 parts In-Stock

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$10.190

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573

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Microchip USA

USA . 3,215 parts In-Stock

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$15.350

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$15.130

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$15.020

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$14.910

3,215

$15.350

$15.130

$15.020

$14.910

Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$40.628

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1,609

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Corohmni

South Africa . 907 parts In-Stock

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$40.728

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$40.728

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DigiPath Technology Company

USA . 1,277 parts In-Stock

1+ parts

$44.737

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$41.158

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1,277

$44.737

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ChromeModa Solutions

Germany . 3,555 parts In-Stock

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$45.650

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$37.433

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3,555

$45.650

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IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$45.650

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$43.368

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$41.085

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679

$45.650

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$41.085

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Argo Parts USA

USA . 590 parts In-Stock

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Overview

Enhance your projects with the Texas Instruments TM4C123BE6PMI7R microcontroller. Crafted by industry leader TI, this powerful device offers unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller boasts integrated cache, ADC channels, and DMA channels, providing seamless connectivity and efficient performance. Elevate your designs with this versatile microcontroller, offering a wide array of peripherals including PWM, UART, USB, and more. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, making your projects shine brighter than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external damage, ensuring the longevity of the microcontroller.

Integrated Cache: YES

Integrated cache helps in improving the performance of the microcontroller by storing frequently used instructions and data, reducing access time.

Surface Mount: YES

Surface mount capability makes it easy to mount the microcontroller on a PCB, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.32 V

Operating within a maximum supply voltage of 1.32 V ensures safe operation and prevents damage to the microcontroller.

On Chip Data RAM Width: 8

Having an on-chip data RAM width of 8 bits allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

Square package shape enables easy integration and layout design on the PCB, optimizing space utilization in the system.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and perform complex calculations with higher precision.

No. of Terminals: 64

Having 64 terminals provides flexibility in interfacing with external components and peripherals, enabling diverse connectivity options.

Minimum Supply Voltage: 1.08 V

Operating with a minimum supply voltage of 1.08 V allows for efficient power management and extends battery life in low-power applications.

CPU Family: CORTEX-M4F

Belonging to the Cortex-M4F family ensures high performance, low power consumption, and optimized processing capabilities for various embedded applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can function reliably in harsh environments or extreme weather conditions.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to convert analog signals into digital data, facilitating sensor interfacing and analog signal processing.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, improving system performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures reliable connections, corrosion resistance, and prolonged shelf life of the microcontroller.

Peripherals: BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

A wide range of integrated peripherals enhances the functionality of the microcontroller, offering diverse capabilities for different application requirements.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz enables fast data processing and execution of instructions, enhancing overall system performance.

No. of Timers: 12

Having 12 timers supports accurate time-based operations, event triggering, and time measurement functions in various applications.

RAM Bytes: 32768

With a RAM size of 32768 bytes, the microcontroller can efficiently store and manipulate data during program execution, improving system responsiveness.

Analog To Digital Convertors: 12-Ch 12-Bit

12-channel 12-bit ADCs enable precise analog signal conversion, making the microcontroller suitable for applications requiring accurate sensor data acquisition.

Connectivity: CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Versatile connectivity options such as CAN, I2C, SPI, UART, and USB support seamless communication with external devices, expanding the range of application possibilities.

Technical Specifications

Microcontrollers TM4C123BE6PMI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

43

No. of Serial I/Os:

18

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123BE6PMI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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