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TM4C1233H6PGEI7

Texas Instruments

TM4C1233H6PGEI7 by Texas Instruments

TM4C1233H6PGEI7 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 144 terminals, and 262K ROM words. Ideal for industrial applications, it features 24-Ch ADCs, 32 DMA channels, and various peripherals like PWM and UART for efficient connectivity at a max clock frequency of 25 MHz.

Median Price

$10.150

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10 parts In-Stock

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$10.150

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$10.150

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Distributors (In-Stock)

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Digiode

USA . 91 parts In-Stock

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$9.642

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91

$9.642

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Vyrian

USA . 7,945 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,961 parts In-Stock

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$9.135

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AZTECH Wire

Italy . 969 parts In-Stock

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$17.200

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Microchip USA

USA . 2,346 parts In-Stock

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$32.590

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$32.130

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$31.890

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$31.660

2,346

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$32.130

$31.890

$31.660

Parana Technologies

USA . 205 parts In-Stock

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$36.047

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205

$36.047

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DigiPath Technology Company

USA . 481 parts In-Stock

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$39.692

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ChromeModa Solutions

Germany . 5,883 parts In-Stock

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$40.502

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$33.212

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

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$40.502

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$38.477

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$36.452

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2,097

$40.502

$38.477

$36.452

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$44.484

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$40.480

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$36.477

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1,000

$44.484

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Overview

Unlock endless possibilities with the Texas Instruments TM4C1233H6PGEI7 microcontroller. Crafted by a trusted manufacturer, this device is a game-changer in the world of electronics. From industrial automation to consumer electronics, its applications are vast and versatile. With unparalleled quality and cutting-edge technology, this microcontroller offers customers unmatched value, performance, and efficiency. Say hello to innovation and reliability with the TM4C1233H6PGEI7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good insulation and protection for the internal components.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microcontroller by reducing the access time to frequently used data.

Maximum Supply Voltage: 1.32 V

The specified maximum supply voltage ensures safe operation of the microcontroller without risking damage to the internal circuitry.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and versatile usage in various applications.

ADC Channels: YES

The presence of Analog to Digital Convertor channels is essential for converting analog signals to digital data, expanding the range of input sources for the microcontroller.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

The wide range of connectivity options allows for seamless integration with external devices and communication protocols, enhancing the versatility of the microcontroller.

Speed: 80 rpm

The specified speed capability indicates the microcontroller's ability to process instructions quickly, suitable for applications requiring high-speed data processing.

Technical Specifications

Microcontrollers TM4C1233H6PGEI7 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

105

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1233H6PGEI7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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