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TM4C1231D5PMTR

Texas Instruments

TM4C1231D5PMTR by Texas Instruments

TM4C1231D5PMTR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 25 MHz clock frequency, and 64 terminals. It features 24576 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$6.480

100+ parts

-

1k+ parts

-

10k+ parts

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950

$6.480

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,399 parts In-Stock

1+ parts

$6.156

100+ parts

-

1k+ parts

-

10k+ parts

-

3,399

$6.156

-

-

-

Vyrian

USA . 3,908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,908

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,856 parts In-Stock

1+ parts

$5.832

100+ parts

-

1k+ parts

-

10k+ parts

-

1,856

$5.832

-

-

-

Parana Technologies

USA . 519 parts In-Stock

1+ parts

$13.573

100+ parts

-

1k+ parts

$14.078

10k+ parts

-

519

$13.573

-

$14.078

-

ChromeModa Solutions

Germany . 2,956 parts In-Stock

1+ parts

$15.251

100+ parts

$12.506

1k+ parts

-

10k+ parts

-

2,956

$15.251

$12.506

-

-

IDEA Electronic Components Group

UK . 650 parts In-Stock

1+ parts

$15.251

100+ parts

$14.488

1k+ parts

$13.726

10k+ parts

-

650

$15.251

$14.488

$13.726

-

AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$17.050

100+ parts

-

1k+ parts

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10k+ parts

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819

$17.050

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Microchip USA

USA . 1,895 parts In-Stock

1+ parts

$32.440

100+ parts

$32.240

1k+ parts

$32.140

10k+ parts

$32.040

1,895

$32.440

$32.240

$32.140

$32.040

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$39.943

100+ parts

$39.543

1k+ parts

$37.945

10k+ parts

-

3,000

$39.943

$39.543

$37.945

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DigiPath Technology Company

USA . 771 parts In-Stock

1+ parts

-

100+ parts

$13.750

1k+ parts

-

10k+ parts

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771

-

$13.750

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-

Overview

Discover the power of innovation with the TM4C1231D5PMTR microcontroller by Texas Instruments. Known for its superior quality and reliability, Texas Instruments offers cutting-edge solutions that cater to a wide range of applications in various industries. This microcontroller boasts advanced features such as ADC channels and DMA channels, providing unparalleled performance and efficiency. With a maximum clock frequency of 25 MHz and a wide temperature range, this product is designed to meet the needs of demanding industrial environments. Trust Texas Instruments to deliver the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this microcontroller can handle a wide range of power requirements.

Package Shape: SQUARE

Square package shape provides efficient use of board space.

Bit Size: 32

32-bit architecture allows for high-speed processing and complex computations.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages provides flexibility in system design.

No. of Terminals: 64

64 terminals offer ample connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles provide compatibility with different PCB layouts and assembly processes.

Minimum Supply Voltage: 3.15 V

Operating at low minimum supply voltage helps in power efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation in harsh environments.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and energy efficiency for embedded applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Integrated ADC channels enable analog signal processing for sensor interfacing.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU workload.

Terminal Position: QUAD

Quad terminal position allows for easy PCB mounting and alignment.

ROM Words: 16384

Large ROM size enables storage of program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height saves space and facilitates compact device design.

Width: 10 mm

Compact width allows for efficient use of board space.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process ensures reliable solder joints and component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component durability.

Length: 10 mm

Compact length enables efficient PCB layout and device integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontroller architecture offers high performance and power efficiency for embedded systems.

RAM Bytes: 24576

Large RAM size allows for efficient data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliability.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enables high-density PCB layouts and compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard PCB assembly processes.

Speed: 80 rpm

High speed capabilities enable fast data processing and response times.

No. of I/O Lines: 43

43 I/O lines provide versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TM4C1231D5PMTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TM4C1231D5PMTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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