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TM4C1231C3PMIR

Texas Instruments

TM4C1231C3PMIR by Texas Instruments

TM4C1231C3PMIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 64 terminals, 12288 bytes of RAM, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed processing and multiple ADC/DMA channels.

Median Price

$5.785

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,714 parts In-Stock

1+ parts

$5.785

100+ parts

$4.716

1k+ parts

$3.144

10k+ parts

-

6,714

$5.785

$4.716

$3.144

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,075 parts In-Stock

1+ parts

$5.496

100+ parts

-

1k+ parts

-

10k+ parts

-

3,075

$5.496

-

-

-

Vyrian

USA . 8,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,135

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,700 parts In-Stock

1+ parts

$5.206

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

$5.206

-

-

-

AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$11.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,023

$11.400

-

-

-

Microchip USA

USA . 2,398 parts In-Stock

1+ parts

$27.860

100+ parts

$27.690

1k+ parts

$27.610

10k+ parts

$27.520

2,398

$27.860

$27.690

$27.610

$27.520

Parana Technologies

USA . 1,795 parts In-Stock

1+ parts

$48.320

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

$48.320

-

-

-

ChromeModa Solutions

Germany . 4,678 parts In-Stock

1+ parts

$54.292

100+ parts

$44.519

1k+ parts

-

10k+ parts

-

4,678

$54.292

$44.519

-

-

IDEA Electronic Components Group

UK . 1,937 parts In-Stock

1+ parts

$54.292

100+ parts

$51.577

1k+ parts

$48.863

10k+ parts

-

1,937

$54.292

$51.577

$48.863

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Component Stockers USA

USA . 1,540 parts In-Stock

1+ parts

$80.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,540

$80.240

-

-

-

DigiPath Technology Company

USA . 986 parts In-Stock

1+ parts

-

100+ parts

$48.950

1k+ parts

-

10k+ parts

-

986

-

$48.950

-

-

Overview

Unlock the potential of your projects with the TM4C1231C3PMIR microcontroller by Texas Instruments. With a powerful Cortex-M4F CPU and advanced features like ADC and DMA channels, this versatile device is perfect for a wide range of applications. The durable plastic/epoxy package ensures reliability in industrial environments, while the low profile design saves space in your designs. Trust Texas Instruments for quality and innovation, and experience the value and benefits that the TM4C1231C3PMIR brings to your projects. Step up your game with this top-notch microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient assembly during manufacturing processes.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, preventing damage from overvoltage.

Package Shape: SQUARE

Square shape helps in efficient placement and utilization of space on PCBs.

Bit Size: 32

A 32-bit architecture ensures higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, offering flexibility in voltage requirements for different applications.

No. of Terminals: 64

Sufficient number of terminals for connectivity and interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles offer compact size, low profile design, and high density mounting options.

Minimum Supply Voltage: 1.08 V

Provides a lower operating voltage option, which can be beneficial for power efficiency in certain applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

CPU Family: CORTEX-M4F

Features a powerful Cortex-M4F CPU for efficient processing and performance.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, ideal for use in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, enabling sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels facilitate efficient data transfers without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers more stability and reliability in connection compared to other configurations.

ROM Words: 8192

Sufficient ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design helps in space-constrained applications and facilitates compact product designs.

Width: 10 mm

Compact width dimension enables versatile placement options on PCBs.

Maximum Clock Frequency: 25 MHz

Supports high clock frequency for fast processing and operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing processes within a specified time limit.

Peak Reflow Temperature °C: 260

Suitable peak reflow temperature for soldering without damaging the microcontroller.

Length: 10 mm

Compact length dimension for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and optimized processing capabilities for various applications.

RAM Bytes: 12288

Generous RAM capacity for temporary data storage and efficient operation of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy assembly and reliable soldering connections.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent and reliable operation.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the program memory as needed.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and miniaturization of PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures safe handling and soldering of the microcontroller during manufacturing processes.

Speed: 80 rpm

Fast speed capability for efficient processing of data and instructions.

No. of I/O Lines: 43

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TM4C1231C3PMIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TM4C1231C3PMIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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