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TM4C1230C3PMIR

Texas Instruments

TM4C1230C3PMIR by Texas Instruments

TM4C1230C3PMIR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features a Cortex-M4F CPU, 12288 bytes of RAM, and ADC/DMA channels for industrial applications requiring high-speed processing and low power consumption.

Median Price

$5.763

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,200 parts In-Stock

1+ parts

$5.763

100+ parts

$4.698

1k+ parts

$3.132

10k+ parts

-

5,200

$5.763

$4.698

$3.132

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 66 parts In-Stock

1+ parts

$3.915

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$3.915

-

-

-

Digiode

USA . 4,017 parts In-Stock

1+ parts

$5.475

100+ parts

-

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-

10k+ parts

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4,017

$5.475

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-

-

Chip Stock

USA . 15,700 parts In-Stock

1+ parts

-

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15,700

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Vyrian

USA . 7,673 parts In-Stock

1+ parts

-

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-

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7,673

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,586 parts In-Stock

1+ parts

$3.915

100+ parts

-

1k+ parts

-

10k+ parts

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4,586

$3.915

-

-

-

Continental Prestige Electronics

USA . 36 parts In-Stock

1+ parts

$3.915

100+ parts

-

1k+ parts

-

10k+ parts

$3.837

36

$3.915

-

-

$3.837

Ampacity Inc.

Singapore . 4,757 parts In-Stock

1+ parts

$4.900

100+ parts

-

1k+ parts

-

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4,757

$4.900

-

-

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Corphita

USA . 1,297 parts In-Stock

1+ parts

$5.187

100+ parts

-

1k+ parts

-

10k+ parts

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1,297

$5.187

-

-

-

AZTECH Wire

Italy . 1,055 parts In-Stock

1+ parts

$10.490

100+ parts

-

1k+ parts

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10k+ parts

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1,055

$10.490

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Microchip USA

USA . 2,709 parts In-Stock

1+ parts

$27.760

100+ parts

$27.590

1k+ parts

$27.500

10k+ parts

$27.420

2,709

$27.760

$27.590

$27.500

$27.420

Parana Technologies

USA . 2,055 parts In-Stock

1+ parts

$34.019

100+ parts

-

1k+ parts

$139.497

10k+ parts

-

2,055

$34.019

-

$139.497

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DigiPath Technology Company

USA . 204 parts In-Stock

1+ parts

$37.460

100+ parts

-

1k+ parts

-

10k+ parts

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204

$37.460

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-

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IDEA Electronic Components Group

UK . 1,581 parts In-Stock

1+ parts

$38.224

100+ parts

$36.313

1k+ parts

$34.402

10k+ parts

-

1,581

$38.224

$36.313

$34.402

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ChromeModa Solutions

Germany . 682 parts In-Stock

1+ parts

$38.224

100+ parts

$31.344

1k+ parts

-

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682

$38.224

$31.344

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Lixinc

USA . 13,445 parts In-Stock

1+ parts

-

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13,445

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

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A-Z Elektronik GmbH

Germany . 1,679 parts In-Stock

1+ parts

-

100+ parts

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1,679

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-

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

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10

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Overview

Unleash the power of innovation with the Texas Instruments TM4C1230C3PMIR microcontroller. Built by a trusted manufacturer, this versatile device offers endless possibilities in various applications. With advanced technology and reliable performance, this microcontroller provides unmatched value, benefits, and advantages for customers seeking cutting-edge solutions. Upgrade your projects with the quality and precision of Texas Instruments, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly on circuit boards.

Maximum Supply Voltage: 1.32 V

The ability to handle a maximum supply voltage of 1.32V makes the product suitable for a variety of electronic applications.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the circuit board.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and data processing efficiently.

Power Supplies (V): 1.2, 3.3

Support for multiple power supplies allows flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external components and peripherals.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels enhance the data transfer efficiency by offloading data movement tasks from the CPU, improving overall system performance.

ROM Words: 8192

The ROM capacity of 8192 words allows for storing program instructions and data, enabling the microcontroller to execute complex tasks.

RAM Bytes: 12288

With 12288 bytes of RAM, the microcontroller can store and manipulate a significant amount of data during program execution.

Technical Specifications

Microcontrollers TM4C1230C3PMIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TM4C1230C3PMIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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