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TM2SR72EPH-10

Texas Instruments

TM2SR72EPH-10 by Texas Instruments

TM2SR72EPH-10 by Texas Instruments is a 3.3V memory IC with 2MX72 organization, 100 MHz clock frequency, and 72-bit memory width. It features a 168-terminal microelectronic assembly package and operates in commercial temperature grade applications. The device offers 4096 refresh cycles, 7.5 ns access time, and is ideal for high-speed data processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,720 parts In-Stock

1+ parts

-

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4,720

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Digiode

USA . 3,226 parts In-Stock

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3,226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 899 parts In-Stock

1+ parts

$2.591

100+ parts

-

1k+ parts

$3.082

10k+ parts

-

899

$2.591

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$3.082

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DigiPath Technology Company

USA . 2,174 parts In-Stock

1+ parts

$2.853

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-

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2,174

$2.853

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ChromeModa Solutions

Germany . 3,211 parts In-Stock

1+ parts

$2.911

100+ parts

$2.387

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3,211

$2.911

$2.387

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IDEA Electronic Components Group

UK . 1,663 parts In-Stock

1+ parts

$2.911

100+ parts

-

1k+ parts

$2.620

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1,663

$2.911

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$2.620

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One Stop Electronics

USA . 703 parts In-Stock

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$4.000

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703

$4.000

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$15.996

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820

$15.996

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Corphita

USA . 2,067 parts In-Stock

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2,067

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Overview

Unlock the power of cutting-edge technology with the TM2SR72EPH-10 by Texas Instruments. Crafted with precision and expertise, this memory IC offers unparalleled performance and reliability for a wide range of applications. Whether you're in the automotive industry, telecommunications, or consumer electronics, this product delivers value like no other. With its advanced features and innovative design, the TM2SR72EPH-10 ensures seamless operation and efficiency, making it the perfect choice for your next project. Trust in Texas Instruments to provide quality solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring the longevity of the product.

Nominal Supply Voltage / Vsup (V): 3.3

Having a nominal supply voltage of 3.3V makes it compatible with a wide range of systems and devices, offering flexibility in application.

No. of Words: 2097152 words

With a large number of words, this memory IC can store a vast amount of data efficiently, making it suitable for applications that require high storage capacity.

Maximum Clock Frequency (fCLK): 100 MHz

The high maximum clock frequency allows for fast data processing and transfer speeds, making the product ideal for applications that require quick response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for various electronic systems.

Technical Specifications

Other Function Memory ICs TM2SR72EPH-10 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

7.5 ns

Maximum Clock Frequency (fCLK):

100 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDMA-N168

Memory Density:

150994944 bit

Memory Width:

72

No. of Terminals:

168

No. of Words:

2097152 words

No. of Words Code:

2M

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2MX72

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

DIMM168

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Standby Current:

.001 Amp

Minimum Standby Voltage:

3 V

Sub-Category:

Other Memory ICs

Maximum Supply Current:

140 mA

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TM2SR72EPH-10 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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