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TLV341IDCKT

Texas Instruments

TLV341IDCKT by Texas Instruments

TLV341IDCKT by Texas Instruments is a CMOS Operational Amplifier with low bias current (0.003 uA) and high common mode rejection ratio (90 dB). Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C with micropower consumption. The small outline package makes it suitable for space-constrained designs.

Median Price

$1.079

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 279 parts In-Stock

1+ parts

$1.500

100+ parts

$0.880

1k+ parts

$0.827

10k+ parts

-

279

$1.500

$0.880

$0.827

-

Rochester

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.863

10k+ parts

$0.770

1,250

-

$1.040

$0.863

$0.770

Verical

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.079

10k+ parts

$0.962

1,250

-

-

$1.079

$0.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,533 parts In-Stock

1+ parts

$0.699

100+ parts

-

1k+ parts

-

10k+ parts

-

1,533

$0.699

-

-

-

Vyrian

USA . 4,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,723

-

-

-

-

BCID Electronics Ltd.

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,057 parts In-Stock

1+ parts

$0.662

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

$0.662

-

-

-

Parana Technologies

USA . 518 parts In-Stock

1+ parts

$0.778

100+ parts

-

1k+ parts

$1.769

10k+ parts

-

518

$0.778

-

$1.769

-

DigiPath Technology Company

USA . 2,100 parts In-Stock

1+ parts

$0.857

100+ parts

$0.788

1k+ parts

-

10k+ parts

-

2,100

$0.857

$0.788

-

-

ChromeModa Solutions

Germany . 2,711 parts In-Stock

1+ parts

$0.874

100+ parts

$0.717

1k+ parts

-

10k+ parts

-

2,711

$0.874

$0.717

-

-

IDEA Electronic Components Group

UK . 195 parts In-Stock

1+ parts

$0.874

100+ parts

-

1k+ parts

$0.787

10k+ parts

-

195

$0.874

-

$0.787

-

Microchip USA

USA . 1,119 parts In-Stock

1+ parts

$10.970

100+ parts

$10.900

1k+ parts

$10.870

10k+ parts

$10.830

1,119

$10.970

$10.900

$10.870

$10.830

Perfect Parts

USA . 2,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,710

-

-

-

-

Speed Components Ltd (Excess)

Israel . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Overview

Unleash the power of precision with the TLV341IDCKT operational amplifier from Texas Instruments. Designed for a wide range of applications, this high-quality op amp delivers unparalleled performance and reliability. With its low-bias design and micropower capabilities, customers can trust that their projects will run smoothly and efficiently. Whether you're working in automotive or industrial settings, the TLV341IDCKT offers a compact solution that provides maximum value and exceptional results. Elevate your designs with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the op amp suitable for a variety of environments.

Maximum Input Offset Voltage: 4000 uV

Ensures precision and accuracy in signal processing applications.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption and efficiency, making it ideal for battery-operated devices.

Nominal Common Mode Reject Ratio: 90 dB

Excellent rejection of common mode noise, ensuring a clean output signal.

Frequency Compensation: YES

Stable performance over a wide range of frequencies, suitable for various applications.

Maximum Seated Height: 1.1 mm

Low profile design for space-constrained applications.

Technology: CMOS

Low power consumption, high input impedance, and rail-to-rail output swing characteristics.

Amplifier Type: OPERATIONAL AMPLIFIER

Versatile and widely used in signal processing, filtering, and amplification applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV341IDCKT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

560

Nominal Slew Rate:

0.9 V/us

Peak Bias Current:

3 nA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

150 μA

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP5/6,.08

Trade Compliance

TLV341IDCKT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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