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TLV341AIDBVRG4

Texas Instruments

TLV341AIDBVRG4 by Texas Instruments

TLV341AIDBVRG4 by Texas Instruments is a CMOS Operational Amplifier with 1.8V supply, 1700uV input offset voltage, and 85dB common mode reject ratio. Ideal for automotive applications due to its low bias current, micropower consumption, and compact design in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,690 parts In-Stock

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5,690

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Digiode

USA . 4,163 parts In-Stock

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4,163

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Nova Conductors

Japan . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 288 parts In-Stock

1+ parts

$1.410

100+ parts

$1.375

1k+ parts

$1.368

10k+ parts

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288

$1.410

$1.375

$1.368

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One Stop Electronics

USA . 161 parts In-Stock

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$2.410

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161

$2.410

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Parana Technologies

USA . 1,846 parts In-Stock

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$5.374

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$6.053

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1,846

$5.374

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$6.053

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ChromeModa Solutions

Germany . 3,427 parts In-Stock

1+ parts

$6.038

100+ parts

$4.951

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3,427

$6.038

$4.951

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IDEA Electronic Components Group

UK . 2,325 parts In-Stock

1+ parts

$6.038

100+ parts

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$5.434

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2,325

$6.038

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$5.434

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Ampacity Inc.

Singapore . 536 parts In-Stock

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$8.410

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536

$8.410

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AZTECH Wire

Italy . 292 parts In-Stock

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$12.733

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292

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Argo Parts USA

USA . 3,260 parts In-Stock

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Continental Prestige Electronics

USA . 1,517 parts In-Stock

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DigiPath Technology Company

USA . 1,335 parts In-Stock

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$5.444

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$5.444

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Corphita

USA . 828 parts In-Stock

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828

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the exceptional performance and reliability of the TLV341AIDBVRG4 by Texas Instruments, a leading manufacturer in the industry. As a member of the Operational Amplifiers category, this product offers unparalleled precision and efficiency for a wide range of applications. From automotive to consumer electronics, this amplifier delivers superior quality and functionality, making it the ideal choice for your next project. Trust in Texas Instruments to provide you with the innovative solutions you need to succeed. Choose the TLV341AIDBVRG4 and experience the value, benefits, and advantages that only the best in the business can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 1700 uV

Low input offset voltage helps in minimizing errors in the output signal.

Nominal Unity Gain Bandwidth: 2200 kHz

High unity gain bandwidth ensures stable and efficient amplification across different frequencies.

Low-Bias: YES

Low bias current ensures minimal power consumption and accurate amplification.

Surface Mount: YES

Enables easy PCB mounting and saves space in the circuit design.

Technical Specifications

Operational Amplifiers (Op Amps) TLV341AIDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

560

Nominal Slew Rate:

0.9 V/us

Peak Bias Current:

3 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

200 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

TLV341AIDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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