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TLV333IDBVR

Texas Instruments

TLV333IDBVR by Texas Instruments

TLV333IDBVR by Texas Instruments is a CMOS Operational Amplifier with 15uV Max Input Offset Voltage, 115dB Nominal CMRR, and 350kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low profile package style and wide temperature range of -40 to 125°C.

Median Price

$0.577

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,065 parts In-Stock

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$0.475

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$0.475

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Texas Instruments

USA . 120,300 parts In-Stock

1+ parts

$0.716

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$0.551

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$0.290

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120,300

$0.716

$0.551

$0.290

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DigiKey

USA . 2,420 parts In-Stock

1+ parts

$0.880

100+ parts

$0.498

1k+ parts

$0.429

10k+ parts

$0.395

2,420

$0.880

$0.498

$0.429

$0.395

Arrow

USA . 57,000 parts In-Stock

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$0.398

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$0.398

Verical

USA . 275 parts In-Stock

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$0.577

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275

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$0.577

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Distributors (In-Stock)

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Digiode

USA . 2,223 parts In-Stock

1+ parts

$0.680

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2,223

$0.680

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Nova Conductors

Japan . 100 parts In-Stock

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$0.754

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$0.754

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Chip Stock

USA . 69,380 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 47,842 parts In-Stock

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Vyrian

USA . 43,898 parts In-Stock

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Cyclops Electronics Ltd

UK . 34,031 parts In-Stock

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Sensible Micro Corp

USA . 2,813 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,800 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 40,956 parts In-Stock

1+ parts

$0.394

100+ parts

$0.384

1k+ parts

$0.382

10k+ parts

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40,956

$0.394

$0.384

$0.382

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Ampacity Inc.

Singapore . 43,851 parts In-Stock

1+ parts

$0.416

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43,851

$0.416

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Corphita

USA . 4,464 parts In-Stock

1+ parts

$0.644

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$0.644

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Continental Prestige Electronics

USA . 2,874 parts In-Stock

1+ parts

$0.754

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$0.739

2,874

$0.754

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$0.739

Argo Parts USA

USA . 1,377 parts In-Stock

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$0.754

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$0.754

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Parana Technologies

USA . 1,717 parts In-Stock

1+ parts

$2.932

100+ parts

$272.249

1k+ parts

$2.638

10k+ parts

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1,717

$2.932

$272.249

$2.638

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DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$3.228

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1,640

$3.228

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ChromeModa Solutions

Germany . 766 parts In-Stock

1+ parts

$3.294

100+ parts

$2.701

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766

$3.294

$2.701

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IDEA Electronic Components Group

UK . 429 parts In-Stock

1+ parts

$3.294

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$2.965

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429

$3.294

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$2.965

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Corohmni

South Africa . 291 parts In-Stock

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$5.060

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$5.060

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$5.485

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$5.211

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$5.211

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$5.485

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$5.211

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Perfect Parts

USA . 276,170 parts In-Stock

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Futuretech Components

Singapore . 51,000 parts In-Stock

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GreenTree Electronics

Israel . 27,000 parts In-Stock

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Lixinc

USA . 16,654 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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iodParts Technologies Inc.

India . 14,691 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,135 parts In-Stock

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Kepictronics

USA . 6,741 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

1+ parts

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$0.739

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$0.716

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$0.701

50

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$0.739

$0.716

$0.701

Overview

Elevate your projects with the TLV333IDBVR from Texas Instruments, a leading manufacturer of high-quality operational amplifiers. Designed with precision and reliability in mind, this small outline, low profile op amp offers exceptional performance in a wide range of applications. From automotive to industrial use, its superior common mode rejection ratio and low bias current ensure optimal results every time. Trust Texas Instruments for top-notch technology that delivers value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Maximum Input Offset Voltage: 15 uV

Low input offset voltage ensures accurate amplification of signals with minimal distortion.

Maximum Average Bias Current (IIB): 0.00013 uA

Low bias current helps in minimizing power consumption and improving signal fidelity.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Nominal Common Mode Reject Ratio: 115 dB

High common mode rejection ratio helps in reducing noise and interference in signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operates on a standard supply voltage of 5V, making it compatible with various systems and applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making it suitable for precision applications.

Nominal Unity Gain Bandwidth: 350 kHz

Higher unity gain bandwidth enables faster signal processing and amplification.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature and reliability, making it suitable for automotive applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV333IDBVR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

350 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

115 dB

Minimum Common Mode Rejection Ratio (CMRR ):

106 dB

Input Offset Voltage Limit:

15 uV

Nominal Slew Rate:

0.16 V/us

Peak Bias Current:

130 pA

Maximum Bias Current (IIB) @25 °C:

130 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

28 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

TLV333IDBVR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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