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TLV341AIDBVRE4

Texas Instruments

TLV341AIDBVRE4 by Texas Instruments

TLV341AIDBVRE4 by Texas Instruments is a micropower operational amplifier with low bias current, offering a nominal unity gain bandwidth of 2200 kHz. It operates at temperatures ranging from -40 to 125 °C and has a max supply voltage limit of 5.5 V. Ideal for automotive applications due to its small outline package and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,995 parts In-Stock

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4,995

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Vyrian

USA . 4,495 parts In-Stock

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4,495

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Nova Conductors

Japan . 62 parts In-Stock

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62

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 672 parts In-Stock

1+ parts

$2.410

100+ parts

$2.350

1k+ parts

$2.338

10k+ parts

-

672

$2.410

$2.350

$2.338

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Ampacity Inc.

Singapore . 1,521 parts In-Stock

1+ parts

$4.410

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-

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1,521

$4.410

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Parana Technologies

USA . 531 parts In-Stock

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$4.909

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$5.441

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531

$4.909

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$5.441

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DigiPath Technology Company

USA . 706 parts In-Stock

1+ parts

$5.406

100+ parts

$4.973

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706

$5.406

$4.973

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ChromeModa Solutions

Germany . 998 parts In-Stock

1+ parts

$5.516

100+ parts

$4.523

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998

$5.516

$4.523

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IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$5.516

100+ parts

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$4.964

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194

$5.516

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$4.964

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One Stop Electronics

USA . 925 parts In-Stock

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$8.410

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925

$8.410

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AZTECH Wire

Italy . 720 parts In-Stock

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$17.019

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720

$17.019

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Argo Parts USA

USA . 3,606 parts In-Stock

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Continental Prestige Electronics

USA . 2,278 parts In-Stock

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Corphita

USA . 986 parts In-Stock

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Bastille Electronics

Australia . 92 parts In-Stock

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Overview

Experience unmatched precision and reliability with the TLV341AIDBVRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality operational amplifiers that excel in various applications. This small outline, low profile op amp offers exceptional performance with minimal power consumption, making it ideal for automotive and micropower applications. With a nominal voltage gain of 560 and a unity gain bandwidth of 2200 kHz, this amplifier ensures optimal signal integrity and stability. Trust Texas Instruments to provide you with the best-in-class components for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the op amp, making it suitable for various environments.

Maximum Input Offset Voltage: 1700 uV

Ensures accuracy in signal processing by minimizing the effects of input offset voltage.

Maximum Average Bias Current (IIB): 0.003 uA

Low bias current ensures minimal power consumption and improves overall efficiency.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and effort during production.

Nominal Common Mode Reject Ratio: 85 dB

Provides high rejection of common mode noise, leading to clean and accurate signal outputs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at low supply voltage, making it suitable for low-power applications.

Maximum Supply Voltage Limit: 5.5 V

Allows for flexibility in power supply options while ensuring safe operation within specified limits.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, expanding its usability in various environments.

Nominal Unity Gain Bandwidth: 2200 kHz

High unity gain bandwidth enables fast and accurate signal processing, ideal for high-frequency applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV341AIDBVRE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

560

Nominal Slew Rate:

0.9 V/us

Peak Bias Current:

3 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

200 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

TLV341AIDBVRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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