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TLV341IDBVT

Texas Instruments

TLV341IDBVT by Texas Instruments

TLV341IDBVT by Texas Instruments is a CMOS Operational Amplifier with 4500uV Max Input Offset Voltage, 85dB Nominal CMRR, and 1.8V Supply Voltage. Ideal for automotive applications due to its low-bias, micropower design and compact size in a small outline package.

Median Price

$1.012

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 749 parts In-Stock

1+ parts

-

100+ parts

$0.993

1k+ parts

$0.825

10k+ parts

$0.735

749

-

$0.993

$0.825

$0.735

Verical

USA . 749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.031

10k+ parts

$0.919

749

-

-

$1.031

$0.919

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,393 parts In-Stock

1+ parts

$0.772

100+ parts

-

1k+ parts

-

10k+ parts

-

2,393

$0.772

-

-

-

Vyrian

USA . 3,968 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

3,968

-

-

-

-

DigiKey Marketplace

USA . 749 parts In-Stock

1+ parts

-

100+ parts

$0.850

1k+ parts

-

10k+ parts

-

749

-

$0.850

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,603 parts In-Stock

1+ parts

$0.732

100+ parts

-

1k+ parts

-

10k+ parts

-

4,603

$0.732

-

-

-

Component Stockers USA

USA . 1,480 parts In-Stock

1+ parts

$0.840

100+ parts

$0.790

1k+ parts

-

10k+ parts

-

1,480

$0.840

$0.790

-

-

Parana Technologies

USA . 1,443 parts In-Stock

1+ parts

$4.689

100+ parts

-

1k+ parts

$5.173

10k+ parts

-

1,443

$4.689

-

$5.173

-

DigiPath Technology Company

USA . 439 parts In-Stock

1+ parts

$5.164

100+ parts

$4.751

1k+ parts

-

10k+ parts

-

439

$5.164

$4.751

-

-

ChromeModa Solutions

Germany . 1,687 parts In-Stock

1+ parts

$5.269

100+ parts

$4.321

1k+ parts

-

10k+ parts

-

1,687

$5.269

$4.321

-

-

IDEA Electronic Components Group

UK . 206 parts In-Stock

1+ parts

$5.269

100+ parts

-

1k+ parts

$4.742

10k+ parts

-

206

$5.269

-

$4.742

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AZTECH Wire

Italy . 645 parts In-Stock

1+ parts

$18.500

100+ parts

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-

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645

$18.500

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Microchip USA

USA . 208 parts In-Stock

1+ parts

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208

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Overview

Experience the superior quality and precision performance of Texas Instruments with the TLV341IDBVT operational amplifier. Designed for a wide range of applications, this compact and reliable op amp offers exceptional value to customers seeking high-quality amplification solutions. With low bias current, micropower capabilities, and a small outline package design, this CMOS technology amplifier delivers optimal performance in automotive-grade environments. Trust Texas Instruments to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Maximum Input Offset Voltage: 4500 uV

Low offset voltage ensures accurate output signal and minimal distortion in the amplification process.

Maximum Average Bias Current (IIB): 0.003 uA

Low bias current leads to improved efficiency and reduced power consumption in operation.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and facilitating automated assembly processes.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio indicates effective rejection of unwanted noise and interference for cleaner output signals.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage, suitable for portable and battery-powered applications.

Maximum Supply Voltage Limit: 5.5 V

Offers a wide range of supply voltage flexibility, enabling compatibility with different power sources.

Frequency Compensation: YES

Provides stability and prevents oscillations in the amplification circuit, ensuring reliable performance.

Minimum Voltage Gain: 560

High voltage gain amplifies weak input signals effectively, suitable for applications requiring signal amplification.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and improved noise immunity, enhancing overall performance.

Nominal Unity Gain Bandwidth: 2200 kHz

High unity gain bandwidth allows for processing higher frequency signals accurately, suitable for a wide range of applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV341IDBVT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

560

Nominal Slew Rate:

0.9 V/us

Peak Bias Current:

3 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

200 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

TLV341IDBVT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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