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TLV320AIC3253IYZKT

Texas Instruments

TLV320AIC3253IYZKT by Texas Instruments

TLV320AIC3253IYZKT by Texas Instruments is a consumer IC with 25 terminals in a square grid array package. Operating temperature range from -40 to 85°C, CMOS technology, and low power supply voltage of 1.5V make it ideal for industrial applications requiring fine pitch components.

Median Price

$7.934

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$6.937

100+ parts

$5.655

1k+ parts

$3.770

10k+ parts

-

2,000

$6.937

$5.655

$3.770

-

DigiKey

USA . 748 parts In-Stock

1+ parts

$8.930

100+ parts

$5.889

1k+ parts

$5.806

10k+ parts

-

748

$8.930

$5.889

$5.806

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,201 parts In-Stock

1+ parts

$6.590

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$6.590

-

-

-

Bristol Electronics

USA . 500 parts In-Stock

1+ parts

$7.557

100+ parts

$3.552

1k+ parts

$3.250

10k+ parts

-

500

$7.557

$3.552

$3.250

-

Vyrian

USA . 8,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,939

-

-

-

-

Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 620 parts In-Stock

1+ parts

$0.475

100+ parts

-

1k+ parts

$1.616

10k+ parts

-

620

$0.475

-

$1.616

-

DigiPath Technology Company

USA . 355 parts In-Stock

1+ parts

$0.523

100+ parts

$0.481

1k+ parts

-

10k+ parts

-

355

$0.523

$0.481

-

-

ChromeModa Solutions

Germany . 2,683 parts In-Stock

1+ parts

$0.534

100+ parts

$0.438

1k+ parts

-

10k+ parts

-

2,683

$0.534

$0.438

-

-

IDEA Electronic Components Group

UK . 1,264 parts In-Stock

1+ parts

$0.534

100+ parts

-

1k+ parts

$0.481

10k+ parts

-

1,264

$0.534

-

$0.481

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$3.160

100+ parts

$2.876

1k+ parts

$2.591

10k+ parts

-

1,000

$3.160

$2.876

$2.591

-

Corphita

USA . 4,274 parts In-Stock

1+ parts

$6.243

100+ parts

-

1k+ parts

-

10k+ parts

-

4,274

$6.243

-

-

-

Microchip USA

USA . 2,615 parts In-Stock

1+ parts

$18.120

100+ parts

$17.870

1k+ parts

$17.740

10k+ parts

$17.610

2,615

$18.120

$17.870

$17.740

$17.610

Overview

Enhance your audio experience with the TLV320AIC3253IYZKT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This consumer IC is perfect for a wide range of applications, offering exceptional performance and efficiency. With a compact design and advanced technology, this product provides value and benefits that will elevate your projects to the next level. Upgrade your audio systems today with the TLV320AIC3253IYZKT and experience unparalleled sound quality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square package shape helps in saving space on the PCB and allows for efficient component placement.

Power Supplies (V): 1.8

The low power supply voltage of 1.8V makes this product energy efficient and suitable for applications requiring low power consumption.

No. of Terminals: 25

Having 25 terminals provides flexibility in connecting various components, making this product versatile for different circuit requirements.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances thermal performance and allows for high-density integration on the PCB.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand higher temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliability in harsh environmental conditions, making this product suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and solderability, ensuring reliable connections and overall product quality.

Terminal Position: BOTTOM

With terminals positioned at the bottom, this product allows for easy and secure mounting on the PCB, enhancing overall assembly efficiency.

Maximum Seated Height: 0.625 mm

The low seated height of 0.625mm enables a compact footprint and efficient use of space on the PCB.

Width: 2.795 mm

The width of 2.795mm ensures compatibility with standard PCB dimensions and allows for seamless integration into existing designs.

Minimum Supply Voltage (Vsup): 1.5 V

The minimum supply voltage requirement of 1.5V ensures compatibility with a wide range of power sources, making this product versatile for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering during assembly, leading to high-quality and durable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and rework processes, ensuring stable and robust connections on the PCB.

Length: 2.795 mm

The length of 2.795mm complements the width and overall compact design of the product, enhancing its suitability for space-constrained applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades, this product can withstand harsh environmental conditions and operate reliably in rugged industrial settings.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of applications, making this product a reliable choice for consumer electronics.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection, enhancing the overall durability and performance of the product.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling efficient use of space and enabling complex circuit designs.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage rating of 1.95V ensures compatibility with a wide range of power sources, providing flexibility in design and application requirements.

Technical Specifications

Other Function Consumer ICs TLV320AIC3253IYZKT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.795 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.795 mm

Trade Compliance

TLV320AIC3253IYZKT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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