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TLV2774IPWRG4

Texas Instruments

TLV2774IPWRG4 by Texas Instruments

TLV2774IPWRG4 by Texas Instruments is a CMOS Operational Amplifier with 4 functions, featuring low bias current (0.00006 uA) and high common mode rejection ratio (82 dB). Ideal for automotive applications due to its small outline package and wide operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 27,400 parts In-Stock

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Vyrian

USA . 3,989 parts In-Stock

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Digiode

USA . 1,960 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 1,558 parts In-Stock

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$4.410

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$4.410

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Parana Technologies

USA . 2,189 parts In-Stock

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$6.096

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$6.872

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DigiPath Technology Company

USA . 395 parts In-Stock

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$6.712

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$6.175

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ChromeModa Solutions

Germany . 2,834 parts In-Stock

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$6.849

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$5.616

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IDEA Electronic Components Group

UK . 1,449 parts In-Stock

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$6.164

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AZTECH Wire

Italy . 630 parts In-Stock

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$7.182

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One Stop Electronics

USA . 794 parts In-Stock

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Component Stockers USA

USA . 624 parts In-Stock

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$99.990

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Microchip USA

USA . 2,869 parts In-Stock

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Corphita

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Assy Fe

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Aranea Global

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Overview

Discover the unparalleled performance of the TLV2774IPWRG4 by Texas Instruments, a top-tier operational amplifier designed to excel in various applications. With Texas Instruments' reputation for quality and innovation, this op amp delivers exceptional value and benefits to customers seeking reliable and efficient solutions. Whether used in automotive, industrial, or consumer electronics, this advanced component ensures precision and reliability, making it the ideal choice for demanding projects. Elevate your designs with the TLV2774IPWRG4 and experience unmatched performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a variety of applications.

Maximum Input Offset Voltage: 2900 uV

The low input offset voltage ensures high accuracy and precision in signal processing applications.

Maximum Average Bias Current (IIB): 0.00035 uA

The low bias current helps in minimizing power consumption and improving overall efficiency.

Surface Mount: YES

Surface mount packaging allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Common Mode Reject Ratio: 82 dB

High common-mode rejection ratio ensures better rejection of noise and interference, leading to cleaner and more accurate signal processing.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement makes the product suitable for low-power applications and battery-operated devices.

Minimum Slew Rate: 4.7 V/us

Fast slew rate enables the amplifier to respond quickly to input voltage changes, making it ideal for applications requiring high-speed signal processing.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the product to be used in various environmental conditions without compromising performance.

Nominal Unity Gain Bandwidth: 4800 kHz

High unity gain bandwidth ensures efficient amplification of signals across a wide range of frequencies.

Technology: CMOS

CMOS technology offers low power consumption, high input impedance, and fast switching speeds, making the product energy-efficient and reliable.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2774IPWRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.7/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

2900 uV

Minimum Voltage Gain:

13000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

350 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

8 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

TLV2774IPWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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