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TLV2770CDGKR

Texas Instruments

TLV2770CDGKR by Texas Instruments

TLV2770CDGKR by Texas Instruments is an Operational Amplifier with 2700uV Max Input Offset Voltage, 82dB CMRR, and 4.7V/us Min Slew Rate. Ideal for applications requiring low-bias current amplification in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,068 parts In-Stock

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7,068

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Digiode

USA . 666 parts In-Stock

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666

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,116 parts In-Stock

1+ parts

$3.561

100+ parts

-

1k+ parts

$4.084

10k+ parts

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2,116

$3.561

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$4.084

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DigiPath Technology Company

USA . 2,131 parts In-Stock

1+ parts

$3.921

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$3.921

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

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$4.001

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$3.601

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2,005

$4.001

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$3.601

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ChromeModa Solutions

Germany . 442 parts In-Stock

1+ parts

$4.001

100+ parts

$3.281

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442

$4.001

$3.281

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AZTECH Wire

Italy . 660 parts In-Stock

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$7.365

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660

$7.365

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One Stop Electronics

USA . 1,566 parts In-Stock

1+ parts

$7.410

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1,566

$7.410

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Corphita

USA . 1,718 parts In-Stock

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Microchip USA

USA . 363 parts In-Stock

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363

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Overview

Discover the exceptional quality of the TLV2770CDGKR operational amplifier by Texas Instruments, a leading manufacturer in the industry. This versatile component offers a wide range of applications, providing customers with reliable performance and precision. With low-bias current and high common mode rejection ratio, this op amp ensures optimal signal processing. Experience the benefits of superior functionality and efficiency with the TLV2770CDGKR, setting new standards in operational amplifiers. Elevate your projects with this innovative solution that delivers unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum Input Offset Voltage: 2700 uV

Low offset voltage ensures accurate and stable performance of the operational amplifier.

Nominal Supply Voltage (Vsup): 2.7

Suitable for low power applications, making it energy-efficient.

Nominal Unity Gain Bandwidth: 4800 kHz

High unity gain bandwidth allows for stable operation and good frequency response.

Maximum Operating Temperature: 70 °C

Can withstand elevated temperatures, making it suitable for various operating environments.

Low-Bias: YES

Low bias current ensures minimal input current variations, improving precision and stability.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2770CDGKR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.7/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Input Offset Voltage Limit:

2700 uV

Minimum Voltage Gain:

13000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

6 V/us

Peak Bias Current:

100 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2770CDGKR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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