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TLV2762IDGK

Texas Instruments

TLV2762IDGK by Texas Instruments

TLV2762IDGK by Texas Instruments is a CMOS Operational Amplifier with low-bias and micropower features. It has a max input offset voltage of 6800 uV, min slew rate of 0.07 V/us, and nominal unity gain bandwidth of 500 kHz. Ideal for industrial applications requiring high precision and low power consumption.

Median Price

$2.750

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 281 parts In-Stock

1+ parts

$2.750

100+ parts

$1.980

1k+ parts

$1.630

10k+ parts

$1.550

281

$2.750

$1.980

$1.630

$1.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,452 parts In-Stock

1+ parts

$2.612

100+ parts

-

1k+ parts

-

10k+ parts

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2,452

$2.612

-

-

-

Chip Stock

USA . 20,710 parts In-Stock

1+ parts

-

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20,710

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Vyrian

USA . 7,393 parts In-Stock

1+ parts

-

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7,393

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-

Distributors (Availability)

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Corphita

USA . 2,330 parts In-Stock

1+ parts

$2.475

100+ parts

-

1k+ parts

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2,330

$2.475

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-

-

Parana Technologies

USA . 683 parts In-Stock

1+ parts

$3.438

100+ parts

-

1k+ parts

$3.963

10k+ parts

-

683

$3.438

-

$3.963

-

DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$3.786

100+ parts

$3.483

1k+ parts

-

10k+ parts

-

1,241

$3.786

$3.483

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-

ChromeModa Solutions

Germany . 6,086 parts In-Stock

1+ parts

$3.863

100+ parts

$3.168

1k+ parts

-

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6,086

$3.863

$3.168

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IDEA Electronic Components Group

UK . 756 parts In-Stock

1+ parts

$3.863

100+ parts

-

1k+ parts

$3.477

10k+ parts

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756

$3.863

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$3.477

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A-Z Elektronik GmbH

Germany . 5,754 parts In-Stock

1+ parts

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5,754

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Lixinc

USA . 1,989 parts In-Stock

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1,989

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Kepictronics

USA . 1,536 parts In-Stock

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1,536

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Overview

Experience superior performance and reliability with the TLV2762IDGK operational amplifiers by Texas Instruments. Designed for industrial-grade applications, these op amps offer exceptional precision and low bias current, making them ideal for sensitive circuitry. With a compact square package and micro-power technology, the TLV2762IDGK provides high voltage gain bandwidth and minimal common mode rejection ratio, ensuring optimal signal integrity. Trust Texas Instruments to deliver cutting-edge solutions for your operational amplifier needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 6800 uV

The low maximum offset voltage ensures high precision and accuracy in signal processing.

Maximum Average Bias Current (IIB): 0.0002 uA

The low bias current helps in conserving power and minimizing signal distortion.

Surface Mount: YES

The surface mount feature allows for easy installation and PCB assembly, saving time and effort.

Nominal Common Mode Reject Ratio: 72 dB

The high common mode rejection ratio ensures the amplifier can effectively reject common-mode noise for cleaner output signal.

Nominal Supply Voltage / Vsup (V): 2.4

The nominal supply voltage is ideal for low power applications, offering efficiency in power consumption.

Minimum Slew Rate: 0.07 V/us

The minimum slew rate indicates the amplifier's ability to respond to rapid changes in input signals, ensuring quick and accurate signal processing.

Micropower: YES

The micropower feature enables the amplifier to operate efficiently with low power consumption, making it suitable for battery-powered devices.

Nominal Unity Gain Bandwidth: 500 kHz

The nominal unity gain bandwidth indicates the frequency range over which the amplifier can provide a unity gain, offering versatility in signal amplification.

Technology: CMOS

The CMOS technology used in the amplifier ensures low power consumption, high input impedance, and noise immunity, making it a reliable choice for various applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2762IDGK attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±0.9/±1.8/1.8/3.6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

500 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

72 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

6800 uV

Minimum Voltage Gain:

18000

Minimum Slew Rate:

0.07 V/us

Nominal Slew Rate:

0.22 V/us

Maximum Input Offset Current (IIO):

15 pA

Peak Bias Current:

200 pA

Maximum Bias Current (IIB) @25 °C:

15 pA

Operational Characteristics

Nominal Supply Voltage:

2.4 V

Maximum Supply Voltage:

4 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

56 μA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold/Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2762IDGK Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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