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TLV2731IDBVTG4

Texas Instruments

TLV2731IDBVTG4 by Texas Instruments

TLV2731IDBVTG4 by Texas Instruments is a CMOS Operational Amplifier with 3000uV Max Input Offset Voltage, 70dB Nominal CMRR, and 1900kHz Unity Gain Bandwidth. Ideal for industrial applications requiring low-bias amplification in compact designs due to its micropower consumption and small outline package.

Median Price

$0.804

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.804

100+ parts

-

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10

$0.804

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Digiode

USA . 4,192 parts In-Stock

1+ parts

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4,192

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Vyrian

USA . 2,986 parts In-Stock

1+ parts

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2,986

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.788

100+ parts

-

1k+ parts

$0.756

10k+ parts

-

1,000

$0.788

-

$0.756

-

Argo Parts USA

USA . 4,162 parts In-Stock

1+ parts

$0.804

100+ parts

-

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4,162

$0.804

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Continental Prestige Electronics

USA . 3,541 parts In-Stock

1+ parts

$0.804

100+ parts

-

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-

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$0.788

3,541

$0.804

-

-

$0.788

Ampacity Inc.

Singapore . 859 parts In-Stock

1+ parts

$2.410

100+ parts

-

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859

$2.410

-

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Parana Technologies

USA . 741 parts In-Stock

1+ parts

$6.231

100+ parts

-

1k+ parts

$6.989

10k+ parts

-

741

$6.231

-

$6.989

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DigiPath Technology Company

USA . 1,252 parts In-Stock

1+ parts

$6.861

100+ parts

$6.312

1k+ parts

-

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1,252

$6.861

$6.312

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ChromeModa Solutions

Germany . 3,159 parts In-Stock

1+ parts

$7.001

100+ parts

$5.741

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3,159

$7.001

$5.741

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IDEA Electronic Components Group

UK . 1,350 parts In-Stock

1+ parts

$7.001

100+ parts

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$6.301

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1,350

$7.001

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$6.301

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One Stop Electronics

USA . 344 parts In-Stock

1+ parts

$8.410

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344

$8.410

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$9.970

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223

$9.970

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Corphita

USA . 3,458 parts In-Stock

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3,458

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Microchip USA

USA . 459 parts In-Stock

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459

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Overview

Discover the ultimate solution for your operational amplifier needs with the TLV2731IDBVTG4 by Texas Instruments. Crafted with precision and expertise, this small outline, shrink pitch op amp offers unparalleled performance with a minimum slew rate of 0.5V/us and a nominal unity gain bandwidth of 1900 kHz. Ideal for industrial applications, this micropower device delivers exceptional quality and reliability, ensuring optimal functionality in a compact package. Experience the benefits of low bias current, high common mode rejection ratio, and seamless frequency compensation. Elevate your designs with Texas Instruments' cutting-edge technology and unleash the full potential of your projects with the TLV2731IDBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the op amp suitable for a variety of applications.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage ensures minimal error in signal processing, ideal for precision applications.

Maximum Average Bias Current (IIB): 0.00015 uA

Low bias current minimizes power consumption and helps maintain signal integrity.

Surface Mount: YES

Enables easy integration onto PCBs, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

Compact shape allows for efficient component placement on a circuit board.

Nominal Common Mode Reject Ratio: 70 dB

Good common mode rejection ratio helps in eliminating noise and interference from the input signal.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, making it compatible with many systems.

Power Supplies (V): 3/5

Versatile power supply options allow for flexibility in system design.

No. of Terminals: 5

Simplifies connectivity and integration into circuits.

Maximum Input Offset Current (IIO): 0.00006 uA

Very low input offset current helps in maintaining accuracy in signal processing.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style saves space and enables high-density PCB designs.

Minimum Slew Rate: 0.5 V/us

Provides fast response time for dynamic signal processing applications.

Maximum Supply Voltage Limit: 12 V

Wide supply voltage range allows for compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High operating temperature range makes the op amp suitable for industrial environments.

Frequency Compensation: YES

Ensures stability and compensation for external factors affecting performance.

Minimum Voltage Gain: 300

High voltage gain amplifies weak signals effectively.

Minimum Operating Temperature: -40 °C

Operates reliably even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile PCB mounting options.

Maximum Seated Height: 1.45 mm

Low profile design saves space and facilitates compact electronic designs.

Width: 1.65 mm

Narrow width enables efficient PCB layout and space utilization.

Micropower: YES

Low power consumption makes it suitable for battery-operated devices and energy-efficient applications.

Peak Reflow Temperature °C: 260

Can withstand high temperature reflow soldering processes for reliable assembly.

Length: 2.9 mm

Compact length allows for efficient circuit board placement.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh conditions.

Low-Bias: YES

Low bias operation reduces errors in signal processing and improves accuracy.

Maximum Negative Supply Voltage Limit: 0 V

Supports single-supply operation for certain applications.

Nominal Unity Gain Bandwidth: 1900 kHz

High unity gain bandwidth enables high-frequency signal processing.

Minimum Common Mode Reject Ratio: 60 dB

Good common mode rejection ratio helps in eliminating noise and interference from the input signal.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto the PCB.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed for amplification and signal processing applications with high accuracy and reliability.

Maximum Supply Current: 1.3 mA

Low supply current consumption for energy-efficient operation.

Nominal Negative Supply Voltage (Vsup): 0 V

Supports single-supply operation for certain applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides stable and accurate amplification.

Packing Method: TR

Tape and reel packing for convenient storage and automated assembly processes.

Nominal Slow Rate: 1.6 V/us

Sufficient slew rate for high-speed signal processing without distortion.

Terminal Pitch: 0.95 mm

Fine terminal pitch allows for compact circuit board layout and high-density designs.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2731IDBVTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

70 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

300

Minimum Slew Rate:

0.5 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.065 in (1.65 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2731IDBVTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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