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TLV271CDBVRG4

Texas Instruments

TLV271CDBVRG4 by Texas Instruments

TLV271CDBVRG4 by Texas Instruments is an Operational Amplifier with 7000uV Max Input Offset Voltage, 85dB Nominal CMRR, and 1V/us Min Slew Rate. Ideal for applications requiring low bias current such as sensor signal conditioning or precision instrumentation due to its 0.00006uA Max Average Bias Current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 176,500 parts In-Stock

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176,500

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Vyrian

USA . 2,888 parts In-Stock

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Digiode

USA . 1,552 parts In-Stock

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1,552

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Parana Technologies

USA . 1,291 parts In-Stock

1+ parts

$0.643

100+ parts

-

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$1.706

10k+ parts

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1,291

$0.643

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$1.706

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DigiPath Technology Company

USA . 57 parts In-Stock

1+ parts

$0.709

100+ parts

$0.652

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57

$0.709

$0.652

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ChromeModa Solutions

Germany . 5,079 parts In-Stock

1+ parts

$0.723

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$0.593

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5,079

$0.723

$0.593

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IDEA Electronic Components Group

UK . 927 parts In-Stock

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$0.723

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$0.651

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927

$0.723

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$0.651

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Corohmni

South Africa . 290 parts In-Stock

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$2.314

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290

$2.314

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Ampacity Inc.

Singapore . 442 parts In-Stock

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$7.410

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AZTECH Wire

Italy . 579 parts In-Stock

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$8.582

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One Stop Electronics

USA . 1,361 parts In-Stock

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$9.410

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$9.410

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Semicontronic

India . 811 parts In-Stock

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$9.410

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$9.175

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$9.128

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811

$9.410

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A-Z Elektronik GmbH

Germany . 10,911 parts In-Stock

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Corphita

USA . 3,782 parts In-Stock

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Kepictronics

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Argo Parts USA

USA . 2,301 parts In-Stock

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Continental Prestige Electronics

USA . 2,267 parts In-Stock

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Microchip USA

USA . 1,055 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the unparalleled performance of the TLV271CDBVRG4 operational amplifier by Texas Instruments. Renowned for its high-quality construction and reliable operation, this op amp is ideal for a wide range of applications. Whether you're designing audio equipment, sensor interfaces, or control systems, this compact device offers unmatched precision and efficiency. With low bias current and exceptional common mode rejection, the TLV271CDBVRG4 ensures optimal signal integrity and accuracy in your circuits. Elevate your designs with the trusted performance of Texas Instruments and experience the difference with the TLV271CDBVRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 7000 uV

Low input offset voltage ensures high precision in signal processing and accurate output.

Maximum Average Bias Current (IIB): 0.00006 uA

Low bias current helps in minimizing power consumption and improves overall efficiency.

Surface Mount: YES

Surface mount capability allows for easy installation and compact PCB design.

Nominal Common Mode Reject Ratio: 85 dB

High common-mode rejection ratio helps in eliminating common-mode noise and interference from the output signal.

Minimum Slew Rate: 1 V/us

Fast slew rate enables quick response to input changes, making it ideal for dynamic signal processing applications.

Nominal Supply Voltage / Vsup (V): 5

Suitable operating voltage for a wide range of applications and compatibility with standard power supplies.

Technology: CMOS

CMOS technology offers low power consumption, high input impedance, and wide bandwidth, making it an efficient choice for various applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides stable operation, high gain accuracy, and low distortion, making it suitable for precision applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV271CDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

7000 uV

Minimum Voltage Gain:

70795

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

660 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV271CDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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