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TLV2702IDGKG4

Texas Instruments

TLV2702IDGKG4 by Texas Instruments

TLV2702IDGKG4 by Texas Instruments is a dual operational amplifier with 5000uV max input offset voltage and 73dB nominal CMRR. Ideal for automotive applications, it operates at -40 to 125 °C with micropower consumption of 0.0034mA. Its compact design features a small outline package with gull wing terminals for surface mount assembly.

Median Price

$6.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$6.840

100+ parts

$4.110

1k+ parts

$3.500

10k+ parts

$2.830

90

$6.840

$4.110

$3.500

$2.830

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$2.480

-

-

-

Digiode

USA . 638 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$4.000

-

-

-

Vyrian

USA . 3,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,512

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,702 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

-

4,702

$2.480

-

-

-

Continental Prestige Electronics

USA . 3,613 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

$2.430

3,613

$2.480

-

-

$2.430

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.480

-

-

-

Corphita

USA . 3,255 parts In-Stock

1+ parts

$3.789

100+ parts

-

1k+ parts

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10k+ parts

-

3,255

$3.789

-

-

-

Parana Technologies

USA . 376 parts In-Stock

1+ parts

$3.822

100+ parts

-

1k+ parts

$4.311

10k+ parts

-

376

$3.822

-

$4.311

-

DigiPath Technology Company

USA . 181 parts In-Stock

1+ parts

$4.208

100+ parts

$3.871

1k+ parts

-

10k+ parts

-

181

$4.208

$3.871

-

-

IDEA Electronic Components Group

UK . 2,332 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

$3.865

10k+ parts

-

2,332

$4.294

-

$3.865

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ChromeModa Solutions

Germany . 452 parts In-Stock

1+ parts

$4.294

100+ parts

$3.521

1k+ parts

-

10k+ parts

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452

$4.294

$3.521

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-

Ampacity Inc.

Singapore . 114 parts In-Stock

1+ parts

$10.210

100+ parts

-

1k+ parts

-

10k+ parts

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114

$10.210

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AZTECH Wire

Italy . 318 parts In-Stock

1+ parts

$18.569

100+ parts

-

1k+ parts

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10k+ parts

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318

$18.569

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-

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Overview

Experience unmatched precision and reliability with the TLV2702IDGKG4 operational amplifiers by Texas Instruments. As a pioneer in semiconductor manufacturing, Texas Instruments ensures top-notch quality in every product. Ideal for automotive applications, these op amps offer ultra-low power consumption, wide supply voltage range, and high input impedance for superior performance. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and efficiency to meet all your operational amplifier needs. Elevate your designs with the TLV2702IDGKG4 and experience unparalleled excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package of this operational amplifier lightweight and cost-effective.

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage ensures accurate signal processing with minimal error.

Maximum Average Bias Current (IIB): 0.0017 uA

Low bias current results in lower power consumption and improved efficiency.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 73 dB

High common-mode rejection ratio ensures that unwanted common-mode signals are effectively suppressed, leading to cleaner output signals.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement makes it suitable for low-power applications.

Power Supplies (V): +-1.25/+-8/2.5/16

Versatile power supply options provide flexibility in different operating conditions.

Maximum Operating Temperature: 125 °C

Wide temperature range allows for reliable operation in various environments.

Minimum Voltage Gain: 30000

High voltage gain capability amplifies signals effectively, making it suitable for applications requiring high amplification.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the operational amplifier energy-efficient and reliable.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2702IDGKG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.25/±8/2.5/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

73 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

30000

Nominal Slew Rate:

2500 V/us

Maximum Input Offset Current (IIO):

250 pA

Peak Bias Current:

1.7 nA

Maximum Bias Current (IIB) @25 °C:

250 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

17 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

3.4 μA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Output Type:

Push-Pull

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2702IDGKG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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