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TLV2702IDG4

Texas Instruments

TLV2702IDG4 by Texas Instruments

TLV2702IDG4 by Texas Instruments is a dual operational amplifier with low bias current (0.00025 uA) and micropower feature. It operates at a wide temperature range (-40 to 125 °C) making it suitable for automotive applications. With a nominal voltage of 2.7 V, it offers high frequency compensation (5.5 kHz) and push-pull output type for precision amplification in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,003 parts In-Stock

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Vyrian

USA . 2,327 parts In-Stock

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Parana Technologies

USA . 1,410 parts In-Stock

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$5.190

100+ parts

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$5.794

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$5.190

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$5.794

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DigiPath Technology Company

USA . 96 parts In-Stock

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$5.714

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$5.257

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ChromeModa Solutions

Germany . 4,119 parts In-Stock

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$5.831

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$4.781

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$5.831

$4.781

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IDEA Electronic Components Group

UK . 405 parts In-Stock

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$5.831

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$5.248

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405

$5.831

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One Stop Electronics

USA . 1,195 parts In-Stock

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$6.410

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$6.410

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AZTECH Wire

Italy . 889 parts In-Stock

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$12.343

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Corphita

USA . 2,661 parts In-Stock

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Microchip USA

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Overview

Unleash the power of precision and efficiency with the TLV2702IDG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Operational Amplifiers (Op Amps) that are versatile and reliable. The TLV2702IDG4 offers unparalleled value and benefits to customers with its micropower technology, low-bias design, and maximum input offset voltage of 6000uV. Whether you're working on automotive applications or require high-performance amplification, this compact and powerful device is sure to exceed your expectations. Elevate your projects with the TLV2702IDG4 and experience the difference that Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Maximum Input Offset Voltage: 6000 uV

The low input offset voltage ensures minimal errors in the output signal, improving accuracy.

Maximum Average Bias Current (IIB): 0.0017 uA

The low bias current helps in reducing power consumption and improving efficiency.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB.

Nominal Common Mode Reject Ratio: 73 dB

The high common mode rejection ratio helps in rejecting noise and interference, resulting in a cleaner output signal.

Nominal Supply Voltage / Vsup (V): 2.7

The low supply voltage requirement makes it suitable for low-power applications.

Power Supplies (V): +-1.25/+-8/2.5/16

The wide range of power supply options provides flexibility in designing and adapting to different voltage requirements.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the product to be used in challenging environments.

Minimum Voltage Gain: 30000

The high voltage gain ensures signal amplification without significant distortion.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for various applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2702IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.25/±8/2.5/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

73 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

30000

Nominal Slew Rate:

2500 V/us

Maximum Input Offset Current (IIO):

250 pA

Peak Bias Current:

1.7 nA

Maximum Bias Current (IIB) @25 °C:

250 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

17 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

3.4 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.905 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Output Type:

Push-Pull

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2702IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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