Loading...

TLV2622IDGKG4

Texas Instruments

TLV2622IDGKG4 by Texas Instruments

TLV2622IDGKG4 by Texas Instruments is a CMOS Operational Amplifier with 4500uV Max Input Offset Voltage, 99dB Nominal CMRR, and 11000kHz Unity Gain Bandwidth. Ideal for automotive applications due to low-bias current, VOLTAGE-FEEDBACK architecture, and compact SQUARE package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,561

-

-

-

-

Digiode

USA . 3,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,768

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,546 parts In-Stock

1+ parts

$2.943

100+ parts

-

1k+ parts

$3.443

10k+ parts

-

1,546

$2.943

-

$3.443

-

DigiPath Technology Company

USA . 210 parts In-Stock

1+ parts

$3.241

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$3.241

-

-

-

ChromeModa Solutions

Germany . 35 parts In-Stock

1+ parts

$3.307

100+ parts

$2.712

1k+ parts

-

10k+ parts

-

35

$3.307

$2.712

-

-

IDEA Electronic Components Group

UK . 30 parts In-Stock

1+ parts

$3.307

100+ parts

-

1k+ parts

$2.976

10k+ parts

-

30

$3.307

-

$2.976

-

One Stop Electronics

USA . 496 parts In-Stock

1+ parts

$4.410

100+ parts

-

1k+ parts

-

10k+ parts

-

496

$4.410

-

-

-

AZTECH Wire

Italy . 651 parts In-Stock

1+ parts

$11.343

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$11.343

-

-

-

Component Stockers USA

USA . 203 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

203

$99.990

-

-

-

Corphita

USA . 4,491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,491

-

-

-

-

Microchip USA

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

114

-

-

-

-

Overview

Experience superior performance and reliability with the TLV2622IDGKG4 operational amplifier by Texas Instruments. Designed with precision and innovation, this amplifier offers unparalleled quality and efficiency in a wide range of applications. Whether you're working on automotive electronics, industrial automation, or consumer electronics, this compact and versatile amplifier delivers exceptional value, benefits, and advantages to meet your needs. Trust Texas Instruments for cutting-edge technology and elevate your projects to the next level with the TLV2622IDGKG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This package material provides durability and protection to the operational amplifier, making it suitable for various applications.

Maximum Input Offset Voltage: 4500 uV

The low input offset voltage ensures accurate and precise amplification of signals, making it a reliable choice for measurement and control systems.

Surface Mount: YES

The surface mount capability allows for easy installation on PCBs, saving space and making it convenient for mass production.

Nominal Common Mode Reject Ratio: 99 dB

With a high common-mode rejection ratio, this operational amplifier effectively rejects noise in the input signal, ensuring clean output signals.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this amplifier suitable for low power applications and integration with standard power sources.

Minimum Slew Rate: 2.3 V/us

The fast slew rate enables this amplifier to quickly respond to changes in input signals, making it ideal for applications that require high-speed amplification.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high input impedance, making this operational amplifier efficient and suitable for battery-powered devices.

Nominal Unity Gain Bandwidth: 11000 kHz

The high unity gain bandwidth ensures stable operation and accurate amplification of signals across a wide frequency range, making it versatile for many applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2622IDGKG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

11 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

99 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

12500

Minimum Slew Rate:

2.3 V/us

Nominal Slew Rate:

7 V/us

Peak Bias Current:

200 pA

Maximum Bias Current (IIB) @25 °C:

50 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2.6 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2622IDGKG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20