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TLV2553IDWG4

Texas Instruments

TLV2553IDWG4 by Texas Instruments

TLV2553IDWG4 by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 3/5 V power supplies. Ideal for industrial applications requiring a small outline package style and 0.2 MHz sample rate for precise data conversion.

Median Price

$25.640

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 21 parts In-Stock

1+ parts

$25.640

100+ parts

$17.120

1k+ parts

$15.550

10k+ parts

-

21

$25.640

$17.120

$15.550

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,423 parts In-Stock

1+ parts

$13.594

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$13.594

-

-

-

Vyrian

USA . 5,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,321

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,318 parts In-Stock

1+ parts

$12.879

100+ parts

-

1k+ parts

-

10k+ parts

-

4,318

$12.879

-

-

-

Parana Technologies

USA . 691 parts In-Stock

1+ parts

$24.699

100+ parts

-

1k+ parts

$25.363

10k+ parts

-

691

$24.699

-

$25.363

-

ChromeModa Solutions

Germany . 5,213 parts In-Stock

1+ parts

$27.752

100+ parts

$22.757

1k+ parts

-

10k+ parts

-

5,213

$27.752

$22.757

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-

IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$27.752

100+ parts

$26.364

1k+ parts

$24.977

10k+ parts

-

1,669

$27.752

$26.364

$24.977

-

DigiPath Technology Company

USA . 1,363 parts In-Stock

1+ parts

-

100+ parts

$25.021

1k+ parts

-

10k+ parts

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1,363

-

$25.021

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Microchip USA

USA . 967 parts In-Stock

1+ parts

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100+ parts

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967

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Perfect Parts

USA . 36 parts In-Stock

1+ parts

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100+ parts

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36

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Cyclops Electronics Ltd (Excess)

UK . 16 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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16

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Overview

Enhance your analog-to-digital conversion experience with the TLV2553IDWG4 by Texas Instruments. Designed with precision and reliability in mind, this converter offers unparalleled performance in a compact package. With 11 analog input channels and a fast conversion time of 4.15 us, this device is perfect for industrial applications where speed and accuracy are crucial. Say goodbye to linearity errors with only 0.0244% maximum error rate. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Experience the difference with the TLV2553IDWG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material, suitable for various applications

No. of Analog In Channels: 11

Allows for multiple input sources to be processed simultaneously

Surface Mount: YES

Easier and more efficient PCB assembly

Package Shape: RECTANGULAR

Space-efficient design for compact PCB layouts

No. of Bits: 12

Higher resolution for more accurate digitized signals

Maximum Linearity Error (EL): 0.0244 %

High precision in signal conversion

Power Supplies (V): 3/5

Flexibility in power requirements

No. of Terminals: 20

Sufficient connectivity options for interfacing with other components

Package Style (Meter): SMALL OUTLINE

Compact size for space-constrained applications

Minimum Supply Voltage: 2.7 V

Operates at low voltage levels for energy efficiency

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature fluctuations

Minimum Operating Temperature: -40 °C

Wide temperature range for versatile deployment

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-term reliability

Terminal Position: DUAL

Enhanced signal integrity and stability

Maximum Conversion Time: 4.15 us

Fast sampling rate for real-time signal processing

Maximum Seated Height: 2.65 mm

Low profile design for compact devices

Width: 7.5 mm

Narrow form factor for space-saving installations

Maximum Time At Peak Reflow Temperature (s): 30

Optimized for reflow soldering processes

Peak Reflow Temperature °C: 260

High temperature tolerance for robust manufacturing conditions

Length: 12.825 mm

Compact dimensions for versatile integration

Temperature Grade: INDUSTRIAL

Indicates reliability in harsh environmental conditions

Maximum Analog Input Voltage: 5.5 V

Wide input voltage range for compatibility with various signals

Sample Rate: 0.2 MHz

High sampling rate for capturing fast-changing signals accurately

Terminal Form: GULL WING

Robust terminal design for secure connections

Maximum Supply Current: 1.2 mA

Low power consumption for energy-efficient operation

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Efficient conversion method for accurate digital representation of analog signals

Nominal Supply Voltage: 5 V

Standard voltage supply for compatibility with most systems

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Flexible output encoding options for varied applications

Terminal Pitch: 1.27 mm

Standardized spacing for easy PCB layout and connection

Minimum Analog Input Voltage: 0 V

Accepts zero voltage input signals for diverse input ranges

Output Format: SERIAL

Efficient data transmission for high-speed communication

Sample and Hold/Track and Hold: SAMPLE

Effective method to capture and maintain input signals during conversion

Technical Specifications

Analog-to-Digital Converters TLV2553IDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

4.15 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

1.2 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.505 in (12.825 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2553IDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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