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TLV2544QDRG4

Texas Instruments

TLV2544QDRG4 by Texas Instruments

TLV2544QDRG4 by Texas Instruments is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 0.2 MHz. It features a max linearity error of 0.0293% and is ideal for automotive applications due to its temperature grade and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,839 parts In-Stock

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Vyrian

USA . 3,726 parts In-Stock

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3,726

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Parana Technologies

USA . 1,564 parts In-Stock

1+ parts

$9.273

100+ parts

$861.130

1k+ parts

$8.346

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1,564

$9.273

$861.130

$8.346

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DigiPath Technology Company

USA . 488 parts In-Stock

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$10.211

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488

$10.211

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ChromeModa Solutions

Germany . 3,655 parts In-Stock

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$10.419

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$8.544

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$10.419

$8.544

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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$10.419

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$9.898

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$9.377

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20

$10.419

$9.898

$9.377

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AZTECH Wire

Italy . 482 parts In-Stock

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$16.658

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482

$16.658

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One Stop Electronics

USA . 1,190 parts In-Stock

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$27.000

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$27.000

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Component Stockers USA

USA . 317 parts In-Stock

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$99.990

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Microchip USA

USA . 1,527 parts In-Stock

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Corphita

USA . 661 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the TLV2544QDRG4 by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This 12-bit ADC offers unparalleled precision and efficiency, making it the perfect choice for automotive systems, industrial automation, and more. Experience seamless performance and unmatched value with the TLV2544QDRG4 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable for long-term use.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile applications and allows for multiple signals to be processed simultaneously.

Surface Mount: YES

Surface mount technology makes installation and integration of the converter easier and more efficient.

No. of Bits: 12

With 12 bits of resolution, this converter is capable of providing accurate and detailed conversion of analog signals.

Maximum Linearity Error (EL): 0.0293%

The low linearity error ensures that the converted digital signals closely match the original analog input signals.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for flexibility in different system configurations.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and makes it suitable for various applications.

Package Style (Meter): SMALL OUTLINE

The compact small outline package saves space and allows for easy integration into tight spaces or densely-packed circuit boards.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes this converter suitable for use in demanding environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the converter can operate reliably in both extreme cold and hot conditions.

Technical Specifications

Analog-to-Digital Converters TLV2544QDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0293 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

4.65 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.39 in (9.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP16,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2544QDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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