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TLV2543IDBR

Texas Instruments

TLV2543IDBR by Texas Instruments

TLV2543IDBR by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 10us max conversion time. Ideal for industrial applications requiring high precision data acquisition at temperatures ranging from -40 to 85°C. Package style: small outline, shrink pitch; technology: CMOS; output format: serial.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,679 parts In-Stock

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Digiode

USA . 1,603 parts In-Stock

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Prism Electronics

USA . 209 parts In-Stock

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AZTECH Wire

Italy . 775 parts In-Stock

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$5.481

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775

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Parana Technologies

USA . 1,203 parts In-Stock

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$19.090

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$19.141

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One Stop Electronics

USA . 1,051 parts In-Stock

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DigiPath Technology Company

USA . 2,254 parts In-Stock

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ChromeModa Solutions

Germany . 6,974 parts In-Stock

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$21.449

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$17.588

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IDEA Electronic Components Group

UK . 1,378 parts In-Stock

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$21.449

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$19.304

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Microchip USA

USA . 4,130 parts In-Stock

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$31.800

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$31.340

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$31.120

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$30.890

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Corphita

USA . 1,089 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precision with the TLV2543IDBR Analog-to-Digital Converter by Texas Instruments. Designed for industrial-grade applications, this converter boasts a 0.0244% maximum linearity error and a rapid 10us maximum conversion time. With 11 analog input channels and a compact small outline package, this device offers unparalleled accuracy and efficiency. Whether you're working on sensor systems, instrumentation, or control systems, the TLV2543IDBR delivers unmatched performance and reliability. Elevate your designs with Texas Instruments' cutting-edge technology and trust in the quality that only a trusted manufacturer can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Analog In Channels: 11

Offers versatility and the ability to handle multiple input signals simultaneously, making it suitable for a variety of applications.

No. of Bits: 12

Provides high resolution and accuracy in converting analog signals to digital, allowing for precise measurements and data acquisition.

Power Supplies (V): 3.3

Operates efficiently with a common and easily available power supply voltage, simplifying the design and integration process.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments where temperature fluctuations are common.

Technology: CMOS

Uses CMOS technology which offers low power consumption and high noise immunity, making it energy-efficient and reliable in various operating conditions.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Employs successive approximation technique for analog-to-digital conversion, which is known for its high accuracy and speed, making it a reliable choice for precision measurements.

Technical Specifications

Analog-to-Digital Converters TLV2543IDBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2543IDBR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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