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TLV2463CDGS

Texas Instruments

TLV2463CDGS by Texas Instruments

TLV2463CDGS by Texas Instruments is a dual operational amplifier with 2200uV max input offset voltage, 80dB CMRR, and 5200kHz unity gain bandwidth. Ideal for precision signal conditioning in commercial applications due to its low bias current and high slew rate of 1.6V/us.

Median Price

$2.200

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,770 parts In-Stock

1+ parts

$2.347

100+ parts

$2.057

1k+ parts

$1.162

10k+ parts

-

49,770

$2.347

$2.057

$1.162

-

Mouser Electronics

USA . 395 parts In-Stock

1+ parts

$3.980

100+ parts

$2.410

1k+ parts

$2.240

10k+ parts

$2.070

395

$3.980

$2.410

$2.240

$2.070

Rochester

USA . 414 parts In-Stock

1+ parts

-

100+ parts

$1.670

1k+ parts

$1.500

10k+ parts

$1.410

414

-

$1.670

$1.500

$1.410

DigiKey

USA . 414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.200

10k+ parts

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414

-

-

$2.200

-

Verical

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.087

10k+ parts

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240

-

-

$2.087

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 675 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

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675

$1.000

-

-

-

DF Sales Co.

USA . 675 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

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675

$1.000

-

-

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Digiode

USA . 3,579 parts In-Stock

1+ parts

$1.530

100+ parts

-

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-

10k+ parts

-

3,579

$1.530

-

-

-

Bristol Electronics

USA . 11,887 parts In-Stock

1+ parts

-

100+ parts

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11,887

-

-

-

-

Chip Stock

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

-

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Vyrian

USA . 3,088 parts In-Stock

1+ parts

-

100+ parts

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3,088

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-

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ACDS - Activité Composants Distribution Service

France . 310 parts In-Stock

1+ parts

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310

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 178 parts In-Stock

1+ parts

$1.449

100+ parts

-

1k+ parts

-

10k+ parts

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178

$1.449

-

-

-

Parana Technologies

USA . 2,215 parts In-Stock

1+ parts

$5.044

100+ parts

-

1k+ parts

$5.604

10k+ parts

-

2,215

$5.044

-

$5.604

-

DigiPath Technology Company

USA . 185 parts In-Stock

1+ parts

$5.554

100+ parts

$5.109

1k+ parts

-

10k+ parts

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185

$5.554

$5.109

-

-

ChromeModa Solutions

Germany . 3,278 parts In-Stock

1+ parts

$5.667

100+ parts

$4.647

1k+ parts

-

10k+ parts

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3,278

$5.667

$4.647

-

-

IDEA Electronic Components Group

UK . 1,426 parts In-Stock

1+ parts

$5.667

100+ parts

-

1k+ parts

$5.100

10k+ parts

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1,426

$5.667

-

$5.100

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A-Z Elektronik GmbH

Germany . 5,028 parts In-Stock

1+ parts

-

100+ parts

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5,028

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-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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Perfect Parts

USA . 556 parts In-Stock

1+ parts

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556

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Kepictronics

USA . 75 parts In-Stock

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75

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Overview

Discover the unmatched performance and reliability of the TLV2463CDGS operational amplifier by Texas Instruments. As a leader in the industry, Texas Instruments brings you a top-notch product that delivers exceptional quality and precision. Ideal for a wide range of applications, this operational amplifier offers customers unparalleled value, benefits, and advantages. Trust Texas Instruments to provide you with the best solution for your operational amplifier needs. Choose the TLV2463CDGS and experience excellence in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage allows for precise signal amplification and accuracy.

Maximum Average Bias Current (IIB): 0.025 uA

Low bias current results in minimal power consumption and improved signal quality.

Surface Mount: YES

Easy to mount on circuit boards for efficient assembly and compact design.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in eliminating noise and interference from the input signal.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a low supply voltage, making it suitable for low-power applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperature environments for reliable performance in various conditions.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth ensures stable operation and high-frequency response.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved overall performance.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2463CDGS attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

25 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP10,.19,20

Trade Compliance

TLV2463CDGS Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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