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TLV2463AQDREP

Texas Instruments

TLV2463AQDREP by Texas Instruments

TLV2463AQDREP by Texas Instruments is a CMOS Operational Amplifier with 1700uV Max Input Offset Voltage, 80dB Nominal CMRR, and 5200kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low bias current of 0.014uA @25C and wide temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,331 parts In-Stock

1+ parts

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8,331

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Digiode

USA . 479 parts In-Stock

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479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,092 parts In-Stock

1+ parts

$1.410

100+ parts

-

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1,092

$1.410

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Parana Technologies

USA . 64 parts In-Stock

1+ parts

$4.600

100+ parts

-

1k+ parts

$5.065

10k+ parts

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64

$4.600

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$5.065

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DigiPath Technology Company

USA . 2,006 parts In-Stock

1+ parts

$5.066

100+ parts

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2,006

$5.066

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ChromeModa Solutions

Germany . 4,021 parts In-Stock

1+ parts

$5.169

100+ parts

$4.239

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4,021

$5.169

$4.239

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$5.169

100+ parts

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1k+ parts

$4.652

10k+ parts

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95

$5.169

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$4.652

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$15.038

100+ parts

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322

$15.038

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Corphita

USA . 1,731 parts In-Stock

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1,731

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Microchip USA

USA . 255 parts In-Stock

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255

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Overview

Experience high-quality performance and reliability with the TLV2463AQDREP operational amplifier by Texas Instruments. This versatile component offers precision and efficiency in a compact package, making it ideal for a wide range of applications. From industrial automation to automotive systems, this op amp delivers exceptional value and benefits to customers looking for superior amplification solutions. Trust Texas Instruments for cutting-edge technology and unmatched quality in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for various applications.

Maximum Input Offset Voltage: 1700 uV

The low maximum input offset voltage ensures accurate and precise signal processing, making the product suitable for high-precision applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making the product suitable for high-volume manufacturing.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V makes the product energy-efficient and suitable for battery-powered applications.

Minimum Slew Rate: 0.8 V/us

The minimum slew rate of 0.8 V/us ensures fast response time and signal handling, making the product suitable for dynamic applications.

Nominal Unity Gain Bandwidth: 5200 kHz

The high nominal unity gain bandwidth ensures stable and reliable performance across a wide range of frequencies, making the product versatile for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable operation in challenging environments, making the product suitable for industrial and automotive applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2463AQDREP attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2463AQDREP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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