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TLV2463AQDR

Texas Instruments

TLV2463AQDR by Texas Instruments

TLV2463AQDR by Texas Instruments is a CMOS Operational Amplifier with 1700uV Max Input Offset Voltage, 80dB Nominal CMRR, and 5200kHz Unity Gain Bandwidth. Ideal for automotive applications due to its compact size (8.65mm x 3.9mm) and low power consumption (2mA max supply current).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,779 parts In-Stock

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3,779

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Vyrian

USA . 2,078 parts In-Stock

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2,078

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,234 parts In-Stock

1+ parts

$5.901

100+ parts

-

1k+ parts

$6.687

10k+ parts

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1,234

$5.901

-

$6.687

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ChromeModa Solutions

Germany . 1,105 parts In-Stock

1+ parts

$6.630

100+ parts

$5.437

1k+ parts

-

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1,105

$6.630

$5.437

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IDEA Electronic Components Group

UK . 226 parts In-Stock

1+ parts

$6.630

100+ parts

-

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$5.967

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226

$6.630

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$5.967

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One Stop Electronics

USA . 878 parts In-Stock

1+ parts

$8.410

100+ parts

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878

$8.410

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$16.827

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512

$16.827

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Component Stockers USA

USA . 281 parts In-Stock

1+ parts

$99.990

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281

$99.990

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Corphita

USA . 1,345 parts In-Stock

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1,345

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DigiPath Technology Company

USA . 978 parts In-Stock

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$5.978

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978

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$5.978

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Microchip USA

USA . 302 parts In-Stock

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302

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Overview

Experience the superior quality and precision engineering of Texas Instruments with the TLV2463AQDR operational amplifier. Ideal for a wide range of applications, this compact and efficient component offers exceptional performance and reliability. Whether you're designing automotive systems or industrial equipment, this amplifier ensures optimal functionality and precise signal processing. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the TLV2463AQDR and discover the difference that quality manufacturing can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the operational amplifier, ensuring a longer lifespan and reliability in various environments.

Maximum Input Offset Voltage: 1700 uV

Low offset voltage allows for accurate signal processing and minimizes errors in the output signal.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage, making it easy to integrate into existing circuits without the need for additional power sources.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth ensures stable and reliable performance in a wide range of frequency applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides high linearity and low distortion, making it suitable for high-precision applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2463AQDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2463AQDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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