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TLV2462QDRG4

Texas Instruments

TLV2462QDRG4 by Texas Instruments

TLV2462QDRG4 by Texas Instruments is a dual operational amplifier with 2200uV max input offset voltage, 80dB CMRR, and 5200kHz unity gain bandwidth. Ideal for automotive applications due to its low bias current, compact size (3.9mm x 4.9mm), and wide temperature range (-40°C to 125°C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,733 parts In-Stock

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6,733

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Digiode

USA . 2,901 parts In-Stock

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2,901

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 879 parts In-Stock

1+ parts

$3.269

100+ parts

-

1k+ parts

$3.794

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879

$3.269

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$3.794

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DigiPath Technology Company

USA . 253 parts In-Stock

1+ parts

$3.600

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253

$3.600

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ChromeModa Solutions

Germany . 1,990 parts In-Stock

1+ parts

$3.673

100+ parts

$3.012

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1,990

$3.673

$3.012

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IDEA Electronic Components Group

UK . 298 parts In-Stock

1+ parts

$3.673

100+ parts

-

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$3.306

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298

$3.673

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$3.306

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AZTECH Wire

Italy . 577 parts In-Stock

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$5.748

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577

$5.748

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One Stop Electronics

USA . 1,245 parts In-Stock

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$7.410

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1,245

$7.410

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Microchip USA

USA . 2,594 parts In-Stock

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Corphita

USA . 1,623 parts In-Stock

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Overview

Elevate your electronic designs with the TLV2462QDRG4 by Texas Instruments, a top-tier manufacturer known for excellence in operational amplifiers. This small outline, dual-terminal amplifier offers unmatched performance and precision with its 80 dB common mode reject ratio and 5200 kHz unity gain bandwidth. Ideal for automotive applications, this voltage-feedback architecture op amp ensures reliable operation even in challenging environments. Trust Texas Instruments to provide you with the quality and reliability you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and protection for the operational amplifier, making it a reliable choice for various applications.

Maximum Input Offset Voltage: 2200 uV

With a maximum input offset voltage of 2200 uV, this operational amplifier offers precise and accurate performance, making it suitable for high-precision applications.

Maximum Average Bias Current (IIB): 0.075 uA

The low maximum average bias current of 0.075 uA helps in reducing power consumption and improving efficiency in the operation of the amplifier.

Surface Mount: YES

Being surface mountable, this operational amplifier provides ease of installation and PCB layout, making it convenient for manufacturing processes.

Nominal Common Mode Reject Ratio: 80 dB

With a high nominal common mode reject ratio of 80 dB, this amplifier can effectively reject common-mode noise and interference, ensuring clean and accurate signal processing.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this amplifier is suitable for low-power applications while providing reliable performance.

Technology: CMOS

Utilizing CMOS technology, this operational amplifier offers low power consumption and high reliability, making it ideal for battery-operated devices and energy-efficient applications.

Maximum Supply Current: 2 mA

With a maximum supply current of 2 mA, this amplifier ensures efficient power usage and allows for operation in various power-constrained environments.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462QDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2462QDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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