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TLV2462CDRG4

Texas Instruments

TLV2462CDRG4 by Texas Instruments

TLV2462CDRG4 by Texas Instruments is a dual operational amplifier with 2200uV max input offset voltage, 80dB nominal CMRR, and 5200kHz unity gain bandwidth. Ideal for precision signal conditioning in commercial temperature applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,670 parts In-Stock

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8,670

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Digiode

USA . 990 parts In-Stock

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990

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Distributors (Availability)

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Parana Technologies

USA . 1,495 parts In-Stock

1+ parts

$1.944

100+ parts

$180.508

1k+ parts

$1.749

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-

1,495

$1.944

$180.508

$1.749

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DigiPath Technology Company

USA . 1,135 parts In-Stock

1+ parts

$2.140

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$2.140

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ChromeModa Solutions

Germany . 4,115 parts In-Stock

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$2.184

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$1.791

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4,115

$2.184

$1.791

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IDEA Electronic Components Group

UK . 2,078 parts In-Stock

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$2.184

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$1.966

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2,078

$2.184

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$1.966

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One Stop Electronics

USA . 1,012 parts In-Stock

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$4.410

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1,012

$4.410

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AZTECH Wire

Italy . 807 parts In-Stock

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$19.770

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807

$19.770

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Component Stockers USA

USA . 741 parts In-Stock

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$99.990

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741

$99.990

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Microchip USA

USA . 4,986 parts In-Stock

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Corphita

USA . 3,701 parts In-Stock

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Perfect Parts

USA . 2,404 parts In-Stock

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A-Z Elektronik GmbH

Germany . 750 parts In-Stock

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Overview

Elevate your electronic designs with the TLV2462CDRG4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This operational amplifier offers superior performance and reliability, making it ideal for a wide range of applications. From precision instrumentation to audio amplification, this versatile component delivers exceptional value, efficiency, and functionality. Trust Texas Instruments to provide cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and low cost, making the product reliable and cost-effective.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage ensures accuracy in signal processing and reduces errors in the output signal.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, saving space and simplifying the manufacturing process.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio indicates the ability to reject noise and interference in the common mode, ensuring a clean output signal.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this product suitable for low power applications and extends battery life.

Minimum Slew Rate: 0.8 V/us

Fast slew rate ensures quick response to input signal changes, making the amplifier suitable for high-speed applications.

Nominal Unity Gain Bandwidth: 5200 kHz

High bandwidth allows for amplification of high-frequency signals without distortion, making the amplifier suitable for broadband applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the amplifier energy-efficient and reliable in noisy environments.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462CDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

25 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2462CDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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