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TLV2460QD

Texas Instruments

TLV2460QD by Texas Instruments

TLV2460QD by Texas Instruments is an Op Amp with 2200uV Max Input Offset Voltage, 80dB CMRR, and 1mA Max Supply Current. Ideal for automotive applications due to its compact size (3.9mm x 4.9mm) and low bias current (0.014uA @25C). Suitable for precision signal conditioning in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,242 parts In-Stock

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6,242

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Digiode

USA . 3,503 parts In-Stock

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3,503

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 443 parts In-Stock

1+ parts

$0.410

100+ parts

-

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443

$0.410

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Parana Technologies

USA . 833 parts In-Stock

1+ parts

$1.525

100+ parts

-

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$2.183

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833

$1.525

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$2.183

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DigiPath Technology Company

USA . 1,583 parts In-Stock

1+ parts

$1.680

100+ parts

$1.545

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1,583

$1.680

$1.545

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ChromeModa Solutions

Germany . 4,462 parts In-Stock

1+ parts

$1.714

100+ parts

$1.405

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4,462

$1.714

$1.405

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IDEA Electronic Components Group

UK . 77 parts In-Stock

1+ parts

$1.714

100+ parts

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$1.543

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77

$1.714

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$1.543

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AZTECH Wire

Italy . 224 parts In-Stock

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$7.581

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224

$7.581

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Microchip USA

USA . 378 parts In-Stock

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378

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Corphita

USA . 354 parts In-Stock

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354

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Overview

Enhance your electronic designs with the Texas Instruments TLV2460QD operational amplifier. Manufactured by a trusted industry leader, this high-quality component offers superior performance and reliability. Ideal for a wide range of applications, from precision instrumentation to automotive systems, this op amp delivers exceptional value with its low power consumption, compact size, and advanced features. Trust Texas Instruments to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 2200 uV

The low maximum input offset voltage ensures accurate and stable operation of the operational amplifier.

Surface Mount: YES

Being surface mountable, this operational amplifier can be easily integrated into compact electronic circuits, saving space and facilitating assembly.

Nominal Common Mode Reject Ratio: 80 dB

With a high common mode reject ratio of 80 dB, this operational amplifier effectively rejects common-mode noise, ensuring clean signal output.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V makes this operational amplifier suitable for low-power applications, helping in reducing power consumption.

Minimum Slew Rate: 0.9 V/us

The minimum slew rate of 0.9 V/us indicates the speed at which the operational amplifier can respond to input signal changes, making it suitable for high-frequency applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this operational amplifier can withstand high-temperature environments, increasing its versatility.

Technology: CMOS

Utilizing CMOS technology, this operational amplifier offers low power consumption, high input impedance, and wide bandwidth, making it ideal for various precision electronics applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2460QD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.9 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2460QD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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