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TLV2460AQDR

Texas Instruments

TLV2460AQDR by Texas Instruments

TLV2460AQDR by Texas Instruments is an Operational Amplifier with 1700uV Max Input Offset Voltage, 80dB CMRR, and 5200kHz Unity Gain Bandwidth. Widely used in automotive applications due to its compact size (4.9mm x 3.9mm) and low power consumption (1mA max supply current).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,481 parts In-Stock

1+ parts

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8,481

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Digiode

USA . 3,774 parts In-Stock

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3,774

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 591 parts In-Stock

1+ parts

$1.410

100+ parts

-

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591

$1.410

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Parana Technologies

USA . 436 parts In-Stock

1+ parts

$5.517

100+ parts

-

1k+ parts

$6.267

10k+ parts

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436

$5.517

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$6.267

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DigiPath Technology Company

USA . 2,239 parts In-Stock

1+ parts

$6.075

100+ parts

$5.589

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-

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2,239

$6.075

$5.589

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IDEA Electronic Components Group

UK . 699 parts In-Stock

1+ parts

$6.199

100+ parts

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$5.579

10k+ parts

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699

$6.199

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$5.579

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ChromeModa Solutions

Germany . 26 parts In-Stock

1+ parts

$6.199

100+ parts

$5.083

1k+ parts

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26

$6.199

$5.083

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AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$13.704

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523

$13.704

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Component Stockers USA

USA . 616 parts In-Stock

1+ parts

$99.990

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616

$99.990

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Corphita

USA . 443 parts In-Stock

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443

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Microchip USA

USA . 394 parts In-Stock

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394

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Overview

Looking for a reliable operational amplifier that delivers exceptional performance and quality? Look no further than the TLV2460AQDR by Texas Instruments! With its advanced technology and superior construction, this op amp is perfect for a wide range of applications. Whether you're designing automotive systems or precision instrumentation, this versatile component offers low bias current, high common mode rejection, and fast slew rate. Trust Texas Instruments to provide you with the best-in-class components for your next project. Choose the TLV2460AQDR and experience the difference in quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation for the components, ensuring long-term reliability.

Maximum Input Offset Voltage: 1700 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and time during assembly.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio rejects unwanted noise and interference, resulting in a cleaner output signal.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently with a low supply voltage, suitable for low-power applications.

Minimum Voltage Gain: 28000

High voltage gain allows for amplification of weak signals without introducing distortion.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth ensures stable operation at higher frequencies, making it ideal for fast signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2460AQDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.9 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2460AQDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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