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TLV2453IDRG4

Texas Instruments

TLV2453IDRG4 by Texas Instruments

TLV2453IDRG4 by Texas Instruments is a dual operational amplifier with 2000uV max input offset voltage, 80dB CMRR, and 35000 min voltage gain. Ideal for automotive applications due to its micropower technology and wide temperature range of -40 to 125°C. Package style is small outline with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,141 parts In-Stock

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Digiode

USA . 4,238 parts In-Stock

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4,238

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Distributors (Availability)

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Parana Technologies

USA . 48 parts In-Stock

1+ parts

$5.891

100+ parts

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$6.675

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48

$5.891

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$6.675

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DigiPath Technology Company

USA . 547 parts In-Stock

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$6.487

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547

$6.487

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ChromeModa Solutions

Germany . 6,247 parts In-Stock

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$6.619

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$5.428

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6,247

$6.619

$5.428

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IDEA Electronic Components Group

UK . 292 parts In-Stock

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$6.619

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$5.957

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292

$6.619

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$5.957

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One Stop Electronics

USA . 891 parts In-Stock

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$7.410

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891

$7.410

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AZTECH Wire

Italy . 414 parts In-Stock

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$16.240

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414

$16.240

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Microchip USA

USA . 4,246 parts In-Stock

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Corphita

USA . 1,836 parts In-Stock

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Overview

Experience superior performance and reliability with the TLV2453IDRG4 operational amplifier from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in all their products. Ideal for a wide range of applications, this op amp offers unmatched precision and efficiency. With its micropower capabilities and high voltage gains, customers can trust in the exceptional value and benefits that the TLV2453IDRG4 brings to their projects. Upgrade your designs with this cutting-edge technology and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring reliable performance over time.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage helps minimize errors in signal processing, making this operational amplifier suitable for precision applications.

Maximum Average Bias Current (IIB): 0.007 uA

Low bias current ensures minimal input signal distortion, making this operational amplifier ideal for high-impedance circuits.

Surface Mount: YES

Surface mount capability allows for easy integration into compact circuit designs, saving space and simplifying assembly processes.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in reducing unwanted noise and interference, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a nominal supply voltage of 3V, making it suitable for low-power applications.

Minimum Slew Rate: 0.02 V/us

Fast slew rate enables rapid response to input signal changes, making this operational amplifier suitable for applications requiring quick signal processing.

Nominal Unity Gain Bandwidth: 200 kHz

High unity gain bandwidth allows for amplification of high-frequency signals without distortion, making this operational amplifier suitable for audio and RF applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2453IDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

200 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

35000

Minimum Slew Rate:

0.02 V/us

Nominal Slew Rate:

0.11 V/us

Peak Bias Current:

7 nA

Maximum Bias Current (IIB) @25 °C:

5 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2453IDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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