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TLV2444AIPWG4

Texas Instruments

TLV2444AIPWG4 by Texas Instruments

TLV2444AIPWG4 by Texas Instruments is a CMOS Operational Amplifier with 4 functions, low bias current of 0.00006 uA, and unity gain bandwidth of 1810 kHz. Ideal for automotive applications due to its micropower design, high common mode rejection ratio, and wide temperature range from -40 to 125 °C.

Median Price

$2.650

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$2.650

1k+ parts

$2.370

10k+ parts

$2.230

99

-

$2.650

$2.370

$2.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 749 parts In-Stock

1+ parts

$2.451

100+ parts

-

1k+ parts

-

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749

$2.451

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Vyrian

USA . 5,277 parts In-Stock

1+ parts

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5,277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,137 parts In-Stock

1+ parts

$1.269

100+ parts

-

1k+ parts

$2.034

10k+ parts

-

1,137

$1.269

-

$2.034

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ChromeModa Solutions

Germany . 961 parts In-Stock

1+ parts

$1.426

100+ parts

$1.169

1k+ parts

-

10k+ parts

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961

$1.426

$1.169

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IDEA Electronic Components Group

UK . 880 parts In-Stock

1+ parts

$1.426

100+ parts

-

1k+ parts

$1.283

10k+ parts

-

880

$1.426

-

$1.283

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Corphita

USA . 2,483 parts In-Stock

1+ parts

$2.322

100+ parts

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2,483

$2.322

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AZTECH Wire

Italy . 1,088 parts In-Stock

1+ parts

$20.220

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1,088

$20.220

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Microchip USA

USA . 2,234 parts In-Stock

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2,234

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DigiPath Technology Company

USA . 2,147 parts In-Stock

1+ parts

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100+ parts

$1.286

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2,147

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$1.286

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Overview

Discover the Texas Instruments TLV2444AIPWG4 Operational Amplifier, a high-quality component that offers precision and reliability for a variety of applications. With a compact design and advanced technology, this op amp provides exceptional performance while maintaining low power consumption. Ideal for automotive and industrial use, the TLV2444AIPWG4 ensures optimal functionality in a wide range of environments. Trust in Texas Instruments to deliver superior products that meet your needs with excellence and innovation. Elevate your projects with the TLV2444AIPWG4 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the components inside the package, ensuring long-term reliability.

Maximum Input Offset Voltage: 950 uV

Low input offset voltage helps minimize errors in amplification, making this op amp suitable for precision applications.

Maximum Average Bias Current (IIB): 0.00006 uA

Low bias current ensures minimal power consumption and accurate signal amplification in low-power applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and enabling automated production processes.

Nominal Common Mode Reject Ratio: 75 dB

High common mode rejection ratio helps eliminate noise and interference in the input signal, resulting in clean and accurate output.

Nominal Supply Voltage / Vsup (V): 3

Low supply voltage requirement makes this op amp suitable for battery-operated or low-power applications.

Minimum Slew Rate: 0.65 V/us

Fast slew rate allows the op amp to respond quickly to input signal changes, enabling high-speed and high-frequency applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes this op amp suitable for harsh environments or automotive applications where temperature fluctuations occur.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures performance in extreme cold conditions, making this op amp versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high input impedance, and rail-to-rail output swing, making this op amp efficient and versatile for different designs.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2444AIPWG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±5/2.7/10 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.81 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

950 uV

Minimum Voltage Gain:

400

Minimum Slew Rate:

0.65 V/us

Nominal Slew Rate:

1.4 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

4.4 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

TLV2444AIPWG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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