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TLV2434CDR

Texas Instruments

TLV2434CDR by Texas Instruments

TLV2434CDR by Texas Instruments is a CMOS Operational Amplifier with 4 functions, Vsup of 3/5V, and low bias current (0.00006 uA). Ideal for applications requiring micropower consumption, it offers high voltage gain (1500) and unity bandwidth of 500 kHz. Suitable for commercial-grade temperature environments.

Median Price

$2.520

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,300 parts In-Stock

1+ parts

$2.520

100+ parts

$2.081

1k+ parts

$1.125

10k+ parts

-

11,300

$2.520

$2.081

$1.125

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,118 parts In-Stock

1+ parts

$2.394

100+ parts

-

1k+ parts

-

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2,118

$2.394

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-

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Vyrian

USA . 5,103 parts In-Stock

1+ parts

-

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10k+ parts

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5,103

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,639 parts In-Stock

1+ parts

$2.268

100+ parts

-

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1,639

$2.268

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-

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Parana Technologies

USA . 180 parts In-Stock

1+ parts

$5.344

100+ parts

-

1k+ parts

$6.012

10k+ parts

-

180

$5.344

-

$6.012

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DigiPath Technology Company

USA . 529 parts In-Stock

1+ parts

$5.885

100+ parts

$5.414

1k+ parts

-

10k+ parts

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529

$5.885

$5.414

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ChromeModa Solutions

Germany . 1,388 parts In-Stock

1+ parts

$6.005

100+ parts

$4.924

1k+ parts

-

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1,388

$6.005

$4.924

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IDEA Electronic Components Group

UK . 907 parts In-Stock

1+ parts

$6.005

100+ parts

-

1k+ parts

$5.404

10k+ parts

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907

$6.005

-

$5.404

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AZTECH Wire

Italy . 1,207 parts In-Stock

1+ parts

$10.460

100+ parts

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1,207

$10.460

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A-Z Elektronik GmbH

Germany . 5,334 parts In-Stock

1+ parts

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5,334

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Overview

Unleash the power of precision with the TLV2434CDR by Texas Instruments. Crafted with excellence in mind, this operational amplifier offers unparalleled performance and reliability for a wide range of applications. From audio equipment to industrial automation, this compact and versatile device delivers exceptional quality and accuracy. Experience the value of superior design and innovation with the TLV2434CDR, where every detail is engineered to exceed expectations. Upgrade your projects today with Texas Instruments' leading-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accuracy in signal processing applications.

Maximum Average Bias Current (IIB): 0.00015 uA

Low bias current helps in minimizing power consumption and improving precision.

Surface Mount: YES

Easy to mount on PCBs, saving space and facilitating automated assembly processes.

No. of Functions: 4

Offering multiple functions in a single component saves on board space and reduces complexity.

Nominal Common Mode Reject Ratio: 83 dB

Good common mode rejection ratio helps in reducing noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for efficient operation and compatibility with standard power sources.

Power Supplies (V): 3/5

Flexibility in power supply options allows for versatile usage in different applications.

No. of Terminals: 14

Sufficient terminals for connecting to external circuits and components.

Maximum Input Offset Current (IIO): 0.00006 uA

Low input offset current helps in maintaining accuracy in signal processing.

Minimum Slew Rate: 0.1 V/us

Fast slew rate enables quick response to input signals, crucial for certain applications.

Maximum Supply Voltage Limit: 12 V

High supply voltage limit allows for operation in a wide range of voltage conditions.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Frequency Compensation: YES

Frequency compensation feature enhances stability and performance in feedback systems.

Minimum Voltage Gain: 1500

High voltage gain amplifies input signals effectively for output.

Micropower: YES

Low power consumption makes it suitable for battery-powered applications.

Nominal Unity Gain Bandwidth: 500 kHz

Good bandwidth for maintaining unity gain at various frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components used in a wide range of signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2434CDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

500 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

1500

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.25 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

500 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2434CDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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