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TLV2402IDGKRG4

Texas Instruments

TLV2402IDGKRG4 by Texas Instruments

TLV2402IDGKRG4 by Texas Instruments is a dual operational amplifier with 1200uV max input offset voltage and 130000 min voltage gain. Ideal for automotive applications, it operates at -40 to 125 °C with low bias current of 0.0003uA. With a compact square package, it offers high CMRR of 120dB and unity gain bandwidth of 5.5kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 4,089 parts In-Stock

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Vyrian

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Digiode

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QIE Inc.

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310

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Nova Conductors

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Semicontronic

India . 1,436 parts In-Stock

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$3.410

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$3.325

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$3.308

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Parana Technologies

USA . 147 parts In-Stock

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$3.926

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$4.399

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DigiPath Technology Company

USA . 687 parts In-Stock

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$4.323

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$3.977

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Ampacity Inc.

Singapore . 687 parts In-Stock

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$4.410

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ChromeModa Solutions

Germany . 5,790 parts In-Stock

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$4.411

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$3.617

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IDEA Electronic Components Group

UK . 835 parts In-Stock

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$3.970

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Corohmni

South Africa . 422 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 627 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Metaverse IC Inc.

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Corphita

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Microchip USA

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Continental Prestige Electronics

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Overview

Enhance your electronic designs with the TLV2402IDGKRG4 operational amplifier by Texas Instruments. Known for their superior quality and reliability, Texas Instruments amplifiers are trusted by professionals worldwide. Ideal for a wide range of applications, this Op Amp offers exceptional performance and precision, making it perfect for automotive use. Experience the value and benefits of using the TLV2402IDGKRG4 in your projects, and elevate your designs to the next level with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the product suitable for a wide range of applications.

Maximum Input Offset Voltage: 1200 uV

Low input offset voltage ensures accurate and precise signal processing, making this product ideal for high-precision applications.

Maximum Average Bias Current (IIB): 0.0009 uA

Low bias current results in minimal power consumption, improving efficiency and reducing heating effects in the circuit.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall system cost.

Nominal Common Mode Reject Ratio: 120 dB

High common mode rejection ratio ensures minimal interference from external noise, resulting in clean and accurate output signals.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement makes the product suitable for portable and battery-powered applications.

Technology: CMOS

CMOS technology offers low power consumption, high input impedance, and compatibility with a wide range of supply voltages, making the product versatile and efficient.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are widely used in signal processing and amplification applications due to their high gain, input impedance, and versatile functionality.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2402IDGKRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.25/±8/2.5/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

120 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

1200 uV

Minimum Voltage Gain:

130000

Nominal Slew Rate:

0.0025 V/us

Maximum Input Offset Current (IIO):

250 pA

Peak Bias Current:

900 pA

Maximum Bias Current (IIB) @25 °C:

300 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

17 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.9 μA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2402IDGKRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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