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TLV2369IDGKT

Texas Instruments

TLV2369IDGKT by Texas Instruments

TLV2369IDGKT by Texas Instruments is an Operational Amplifier with 2 functions, featuring a Max Input Offset Voltage of 2000 uV and Nominal Unity Gain Bandwidth of 12 kHz. Ideal for automotive applications due to its low-bias current and micropower design.

Median Price

$1.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 57,700 parts In-Stock

1+ parts

$1.289

100+ parts

$0.992

1k+ parts

$0.522

10k+ parts

-

57,700

$1.289

$0.992

$0.522

-

DigiKey

USA . 400 parts In-Stock

1+ parts

$1.670

100+ parts

$0.990

1k+ parts

$0.931

10k+ parts

-

400

$1.670

$0.990

$0.931

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,656 parts In-Stock

1+ parts

$1.225

100+ parts

-

1k+ parts

-

10k+ parts

-

2,656

$1.225

-

-

-

Chip Stock

USA . 27,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,790

-

-

-

-

Vyrian

USA . 6,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,861

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,442 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

4,442

$1.160

-

-

-

Parana Technologies

USA . 2,148 parts In-Stock

1+ parts

$1.177

100+ parts

-

1k+ parts

$1.982

10k+ parts

-

2,148

$1.177

-

$1.982

-

DigiPath Technology Company

USA . 895 parts In-Stock

1+ parts

$1.297

100+ parts

$1.193

1k+ parts

-

10k+ parts

-

895

$1.297

$1.193

-

-

ChromeModa Solutions

Germany . 931 parts In-Stock

1+ parts

$1.323

100+ parts

$1.085

1k+ parts

-

10k+ parts

-

931

$1.323

$1.085

-

-

IDEA Electronic Components Group

UK . 501 parts In-Stock

1+ parts

$1.323

100+ parts

-

1k+ parts

$1.191

10k+ parts

-

501

$1.323

-

$1.191

-

Overview

Elevate your electronic projects with the TLV2369IDGKT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality operational amplifiers that are reliable and efficient. This amplifier is perfect for a wide range of applications, providing excellent performance and precision. With its low-bias and micropower features, you can trust that this product will exceed your expectations. Take your designs to the next level with the TLV2369IDGKT and experience unparalleled value and benefits that only Texas Instruments can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring long-term performance.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage minimizes errors in voltage measurements and improves accuracy in signal processing applications.

Maximum Average Bias Current (IIB): 0.00011 uA

Low average bias current ensures minimal power consumption and maintains signal integrity in low-power applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost in production processes.

Nominal Common Mode Reject Ratio: 110 dB

High common mode rejection ratio allows the amplifier to effectively reject common mode noise and interference for clean signal output.

Maximum Supply Voltage Limit: 7 V

Provides a safe operating voltage range for the amplifier, preventing damage from overvoltage conditions.

Minimum Voltage Gain: 10000

High minimum voltage gain ensures amplification of weak signals with minimal distortion, making it suitable for precision applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh automotive environments, making it ideal for automotive electronics applications.

Nominal Unity Gain Bandwidth: 12 kHz

High unity gain bandwidth allows for amplification of signals with high frequencies, making it suitable for audio and communications applications.

Maximum Supply Current: 0.0026 mA

Low supply current consumption makes it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2369IDGKT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

12 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.005 V/us

Peak Bias Current:

110 pA

Maximum Bias Current (IIB) @25 °C:

110 pA

Operational Characteristics

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2.6 μA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold/Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TLV2369IDGKT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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