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TLK3101IRCPG4

Texas Instruments

TLK3101IRCPG4 by Texas Instruments

TLK3101IRCPG4 by Texas Instruments is a Line Transceiver with 64 terminals, operating at -40 to 85°C. It features Differential Output and Input, with a supply voltage range of 2.3V to 2.7V. Ideal for industrial applications requiring high-speed data transmission over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,570 parts In-Stock

1+ parts

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5,570

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Digiode

USA . 3,955 parts In-Stock

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3,955

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Chip Stock

USA . 3,430 parts In-Stock

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3,430

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 686 parts In-Stock

1+ parts

$2.837

100+ parts

-

1k+ parts

$3.325

10k+ parts

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686

$2.837

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$3.325

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DigiPath Technology Company

USA . 160 parts In-Stock

1+ parts

$3.124

100+ parts

$2.874

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160

$3.124

$2.874

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ChromeModa Solutions

Germany . 3,540 parts In-Stock

1+ parts

$3.188

100+ parts

$2.614

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3,540

$3.188

$2.614

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IDEA Electronic Components Group

UK . 885 parts In-Stock

1+ parts

$3.188

100+ parts

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$2.869

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885

$3.188

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$2.869

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AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$8.401

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554

$8.401

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One Stop Electronics

USA . 257 parts In-Stock

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$31.500

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257

$31.500

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Corphita

USA . 2,322 parts In-Stock

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Microchip USA

USA . 493 parts In-Stock

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493

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Overview

Discover the cutting-edge TLK3101IRCPG4 by Texas Instruments, a high-quality Line Driver & Receiver that offers unmatched performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is guaranteed to exceed your expectations. Ideal for a wide range of applications, this line driver/receiver delivers superior value, benefits, and advantages to customers looking for top-notch connectivity solutions. Upgrade your systems with the TLK3101IRCPG4 and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 2.7 V

Can handle a relatively high supply voltage, making it suitable for a variety of applications.

Package Shape: SQUARE

Square shape helps in efficient and compact packaging, saving valuable space on the PCB.

No. of Terminals: 64

Having a high number of terminals allows for multiple connections and versatile usage.

Minimum Supply Voltage: 2.3 V

Can operate at a low supply voltage, providing flexibility in power requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a factor.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, ensuring reliability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers good conductivity and corrosion resistance, enhancing the product's performance and longevity.

Terminal Position: QUAD

Quad terminal position allows for easy connections and can support multiple signal paths.

Maximum Seated Height: 1 mm

Low seated height helps in keeping the overall profile of the product compact and space-efficient.

Width: 10 mm

Compact width makes the product suitable for applications where space is limited.

Differential Output: YES

Differential output helps in reducing noise and improving signal quality in communication systems.

Peak Reflow Temperature: 260 C

Can handle high reflow temperatures during assembly processes, ensuring durability and reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes the product suitable for harsh operating conditions.

Input Characteristics: DIFFERENTIAL

Differential input allows for better noise immunity and signal integrity, especially in long-distance communication.

Technical Specifications

Line Drivers & Receivers TLK3101IRCPG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK3101IRCPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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