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TLK3101IRCP

Texas Instruments

TLK3101IRCP by Texas Instruments

TLK3101IRCP by Texas Instruments is a Line Transceiver with 64 terminals, operating at -40 to 85 °C. It features Differential Output and Input, with a supply voltage range of 2.3V to 2.7V. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$21.470

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

$21.470

100+ parts

$21.040

1k+ parts

$20.610

10k+ parts

-

5

$21.470

$21.040

$20.610

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 488 parts In-Stock

1+ parts

$20.396

100+ parts

-

1k+ parts

-

10k+ parts

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488

$20.396

-

-

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Chip Stock

USA . 3,543 parts In-Stock

1+ parts

-

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3,543

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Vyrian

USA . 2,660 parts In-Stock

1+ parts

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2,660

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Bristol Electronics

USA . 66 parts In-Stock

1+ parts

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66

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Atlantic Semiconductor

USA . 66 parts In-Stock

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66

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Sea View Technologies

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 459 parts In-Stock

1+ parts

$7.475

100+ parts

-

1k+ parts

$7.964

10k+ parts

-

459

$7.475

-

$7.964

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DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

$8.231

100+ parts

$7.573

1k+ parts

-

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1,545

$8.231

$7.573

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ChromeModa Solutions

Germany . 4,158 parts In-Stock

1+ parts

$8.399

100+ parts

$6.887

1k+ parts

-

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4,158

$8.399

$6.887

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

1+ parts

$8.399

100+ parts

$7.979

1k+ parts

$7.559

10k+ parts

-

1,099

$8.399

$7.979

$7.559

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AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$12.380

100+ parts

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371

$12.380

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$15.968

100+ parts

$14.531

1k+ parts

$13.094

10k+ parts

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1,000

$15.968

$14.531

$13.094

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Corphita

USA . 947 parts In-Stock

1+ parts

$19.323

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947

$19.323

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Microchip USA

USA . 166 parts In-Stock

1+ parts

$207.930

100+ parts

$202.390

1k+ parts

$199.610

10k+ parts

$196.840

166

$207.930

$202.390

$199.610

$196.840

A-Z Elektronik GmbH

Germany . 5,013 parts In-Stock

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5,013

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Perfect Parts

USA . 1,124 parts In-Stock

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1,124

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Overview

Unleash the power of seamless communication with the TLK3101IRCP by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and reliability. Perfect for a wide range of applications, this product delivers exceptional value to customers seeking efficient data transmission. Experience the benefits of smooth operation and enhanced performance with Texas Instruments' TLK3101IRCP, the ultimate choice for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.7 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape offers better alignment and placement on circuit boards.

No. of Terminals: 64

With 64 terminals, the product can handle complex signal routing and connections efficiently.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, thin profile, and fine pitch design results in optimized thermal performance and space-saving benefits.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement ensures energy efficiency and operation under various power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables reliable operation in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides corrosion resistance and ensures long-term reliability.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and connectivity in applications with high vibration or movement.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact designs and efficient use of space within electronic devices.

Width: 10 mm

The 10mm width provides a balance between size and functionality, suitable for various applications.

Differential Output: YES

Differential output ensures high signal integrity and noise immunity, critical for reliable data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the thermal stress on components during assembly, improving overall product reliability.

Peak Reflow Temperature °C: 260

Being able to withstand a peak reflow temperature of 260°C ensures the product's durability during manufacturing processes.

Length: 10 mm

The 10mm length offers a compact form factor suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates the product's reliability and performance in demanding operational environments.

Maximum Receive Delay: 0 ns

The 0ns maximum receive delay ensures real-time signal processing and minimal latency in communication.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and facilitates automated soldering processes during assembly.

Input Characteristics: DIFFERENTIAL

Differential input characteristics allow for better noise rejection and signal integrity, essential for high-speed data transmission.

Nominal Supply Voltage: 2.5 V

The 2.5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers high-density packaging and efficient signal routing capabilities.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture and ensures reliability in humid environments.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC type allows for efficient signal conversion and communication between different systems.

Technical Specifications

Line Drivers & Receivers TLK3101IRCP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK3101IRCP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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