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TLIN2029DRBTQ1

Texas Instruments

TLIN2029DRBTQ1 by Texas Instruments

ETHERNET TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

Median Price

$2.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,950 parts In-Stock

1+ parts

$1.349

100+ parts

$1.037

1k+ parts

$0.546

10k+ parts

-

49,950

$1.349

$1.037

$0.546

-

DigiKey

USA . 324 parts In-Stock

1+ parts

$2.150

100+ parts

$1.290

1k+ parts

-

10k+ parts

-

324

$2.150

$1.290

-

-

Mouser Electronics

USA . 113 parts In-Stock

1+ parts

$2.150

100+ parts

$1.300

1k+ parts

$1.110

10k+ parts

$1.080

113

$2.150

$1.300

$1.110

$1.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 203 parts In-Stock

1+ parts

$1.282

100+ parts

-

1k+ parts

-

10k+ parts

-

203

$1.282

-

-

-

Vyrian

USA . 9,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,432

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 16,416 parts In-Stock

1+ parts

$1.150

100+ parts

$1.121

1k+ parts

$1.116

10k+ parts

-

16,416

$1.150

$1.121

$1.116

-

Corphita

USA . 1,285 parts In-Stock

1+ parts

$1.214

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

$1.214

-

-

-

Corohmni

South Africa . 199 parts In-Stock

1+ parts

$1.349

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$1.349

-

-

-

Parana Technologies

USA . 2,365 parts In-Stock

1+ parts

$7.763

100+ parts

-

1k+ parts

$8.303

10k+ parts

-

2,365

$7.763

-

$8.303

-

DigiPath Technology Company

USA . 167 parts In-Stock

1+ parts

$8.548

100+ parts

$7.864

1k+ parts

-

10k+ parts

-

167

$8.548

$7.864

-

-

ChromeModa Solutions

Germany . 6,719 parts In-Stock

1+ parts

$8.722

100+ parts

$7.152

1k+ parts

-

10k+ parts

-

6,719

$8.722

$7.152

-

-

IDEA Electronic Components Group

UK . 1,615 parts In-Stock

1+ parts

$8.722

100+ parts

$8.286

1k+ parts

$7.850

10k+ parts

-

1,615

$8.722

$8.286

$7.850

-

Lixinc

USA . 2,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,209

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,500

-

-

-

-

Technical Specifications

Network Interfaces TLIN2029DRBTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

.02 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TLIN2029DRBTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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