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TLIN2022DMTTQ1

Texas Instruments

TLIN2022DMTTQ1 by Texas Instruments

TLIN2022DMTTQ1 by Texas Instruments is an AEC-Q100 compliant network interface with 2 channels, 0.02 Mbps data rate, and 24V nominal voltage. Ideal for automotive applications due to its small outline package style and wide operating temperature range from -40°C to 125°C.

Median Price

$1.886

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,654 parts In-Stock

1+ parts

$1.886

100+ parts

$1.558

1k+ parts

$0.842

10k+ parts

-

16,654

$1.886

$1.558

$0.842

-

DigiKey

USA . 202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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202

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-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,287 parts In-Stock

1+ parts

$1.792

100+ parts

-

1k+ parts

-

10k+ parts

-

4,287

$1.792

-

-

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Vyrian

USA . 6,746 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,746

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,128 parts In-Stock

1+ parts

$1.697

100+ parts

-

1k+ parts

-

10k+ parts

-

3,128

$1.697

-

-

-

Parana Technologies

USA . 2,309 parts In-Stock

1+ parts

$6.783

100+ parts

-

1k+ parts

$7.436

10k+ parts

-

2,309

$6.783

-

$7.436

-

DigiPath Technology Company

USA . 1,768 parts In-Stock

1+ parts

$7.469

100+ parts

-

1k+ parts

-

10k+ parts

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1,768

$7.469

-

-

-

ChromeModa Solutions

Germany . 6,786 parts In-Stock

1+ parts

$7.621

100+ parts

$6.249

1k+ parts

-

10k+ parts

-

6,786

$7.621

$6.249

-

-

IDEA Electronic Components Group

UK . 1,869 parts In-Stock

1+ parts

$7.621

100+ parts

-

1k+ parts

$6.859

10k+ parts

-

1,869

$7.621

-

$6.859

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QUARKTWIN TECHNOLOGY LTD

USA . 24,551 parts In-Stock

1+ parts

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24,551

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Lixinc

USA . 16,890 parts In-Stock

1+ parts

-

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16,890

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-

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A-Z Elektronik GmbH

Germany . 8,750 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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8,750

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-

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Futuretech Components

Singapore . 1,782 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,782

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Enhance your automotive electronics with the TLIN2022DMTTQ1 by Texas Instruments, a top-quality network interface designed for reliability and performance. With its durable plastic/epoxy construction and AEC-Q100 screening level, this interface ensures seamless connectivity in harsh environments. Ideal for interface circuits, this product offers dual terminal positions, high-speed data rates, and a wide supply voltage range of 24V. Trust Texas Instruments to deliver cutting-edge solutions that bring value and efficiency to your applications. Experience the advantages of superior design and engineering with the TLIN2022DMTTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making the product ideal for automotive applications where robust performance is essential.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing systems and provides a compact form factor for space-constrained applications.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options, enabling the product to be used in a wide range of network setups.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design contribute to efficient heat dissipation and space-saving, making the product suitable for compact devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function effectively in both extreme cold and hot climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's overall durability and longevity.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options and improves signal integrity, ensuring reliable data transmission.

Maximum Seated Height: 0.9 mm

The low maximum seated height contributes to a slim profile and space-saving design, ideal for applications where size constraints are a concern.

Width: 3 mm

The compact width makes the product suitable for installations in tight spaces while maintaining a streamlined appearance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of heat-induced damage during assembly, ensuring the product's longevity and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering and rework processes, resulting in reliable connections and long-term performance.

Length: 4.5 mm

The moderate length provides a balance between compactness and usability, making the product suitable for various applications without sacrificing performance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand the harsh conditions of automotive environments, making it a reliable choice for vehicle applications.

No. of Channels: 2

Having 2 channels allows for simultaneous data transmission, improving efficiency and performance in multi-network setups.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with regulations, making the product a sustainable choice for green-conscious consumers.

Telecom IC Type: INTERFACE CIRCUIT

The telecom IC type interface circuit ensures compatibility with telecom systems, enabling seamless integration and optimal performance in network environments.

Nominal Supply Voltage: 24 V

The 24V nominal supply voltage is common in many applications, providing compatibility and ease of use in various network setups.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, enabling the product to be used in compact devices and systems without compromising performance.

Data Rate: 0.02 Mbps

The data rate of 0.02 Mbps is sufficient for many network applications, providing reliable data transmission and optimal performance in a variety of network environments.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability in various operating conditions.

Technical Specifications

Network Interfaces TLIN2022DMTTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

.02 Mbps

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TLIN2022DMTTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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