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TLC7524IDG4

Texas Instruments

TLC7524IDG4 by Texas Instruments

TLC7524IDG4 by Texas Instruments is an 8-bit D/A converter with max analog output voltage of ±10 V, settling time of 0.1 us, and linearity error of 0.1953%. Ideal for applications requiring precise analog signal generation in industrial automation, test equipment, and instrumentation due to its small outline package and high sample rate of 10 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,768 parts In-Stock

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Digiode

USA . 651 parts In-Stock

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Prism Electronics

USA . 18 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 9 parts In-Stock

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AZTECH Wire

Italy . 771 parts In-Stock

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$10.948

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Parana Technologies

USA . 656 parts In-Stock

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$16.768

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$17.020

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DigiPath Technology Company

USA . 38 parts In-Stock

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$18.463

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$16.986

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ChromeModa Solutions

Germany . 6,213 parts In-Stock

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$18.840

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$15.449

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

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$18.840

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$17.898

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$16.956

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One Stop Electronics

USA . 497 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 1,453 parts In-Stock

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Microchip USA

USA . 1,795 parts In-Stock

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Corphita

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Overview

Enhance your digital-to-analog conversion experience with the TLC7524IDG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the field of Digital-to-Analog Converters. This versatile product offers a maximum analog output voltage of 10V, making it ideal for a wide range of applications. With a quick settling time of 0.1us and a compact package style, this D/A Converter provides exceptional performance while maintaining a small footprint. Trust Texas Instruments to provide value and innovation in every product they offer.

Feature Benefit Bullets

Maximum Analog Output Voltage - 10 V

Capable of providing a high voltage output signal, making it suitable for a wide range of applications requiring a strong analog signal.

Package Body Material - PLASTIC/EPOXY

Durable and cost-effective material choice for the package body, ensuring reliability and easy handling during installation.

Surface Mount - YES

Enables easy installation on circuit boards, saving space and allowing for automated assembly processes.

No. of Bits - 8

Offers a sufficient resolution for converting digital data into precise analog signals, suitable for many applications.

Maximum Settling Time - 0.1 us

Quick settling time ensures accurate and stable output signals shortly after a change in input, enhancing performance efficiency.

Power Supplies (V) - 5/15

Support for multiple power supply options provides flexibility and compatibility with different systems and voltage requirements.

Maximum Operating Temperature - 85 °C

Wide operating temperature range allows for use in various environmental conditions without compromising performance.

Sample Rate - 10 MHz

High sample rate capability enables rapid conversion of digital signals to analog output signals, suitable for high-speed applications.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and reliability.

Technical Specifications

Digital-to-Analog Converters TLC7524IDG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

100 ns

Maximum Supply Current:

2 mA

Maximum Settling Time:

100 ns

Sample Rate:

10 MHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5/15 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.39 in (9.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

TLC7524IDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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