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TLC7524CNSG4

Texas Instruments

TLC7524CNSG4 by Texas Instruments

TLC7524CNSG4 by Texas Instruments is an 8-bit D/A converter with a max analog output voltage of ±10 V. It operates on power supplies of 5/15 V and has a settling time of 0.1 us. Ideal for applications requiring precise voltage outputs in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,843 parts In-Stock

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Digiode

USA . 729 parts In-Stock

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729

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 580 parts In-Stock

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$13.694

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580

$13.694

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Parana Technologies

USA . 1,387 parts In-Stock

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$16.493

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$16.782

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1,387

$16.493

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$16.782

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ChromeModa Solutions

Germany . 5,130 parts In-Stock

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$18.531

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$15.195

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$18.531

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IDEA Electronic Components Group

UK . 1,630 parts In-Stock

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$18.531

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$17.604

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$16.678

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1,630

$18.531

$17.604

$16.678

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Ampacity Inc.

Singapore . 1,370 parts In-Stock

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$21.000

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One Stop Electronics

USA . 234 parts In-Stock

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$37.000

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Continental Prestige Electronics

USA . 6,553 parts In-Stock

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Argo Parts USA

USA . 4,364 parts In-Stock

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Corphita

USA . 2,973 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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DigiPath Technology Company

USA . 619 parts In-Stock

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$16.708

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Overview

Elevate your digital-to-analog conversion experience with the TLC7524CNSG4 by Texas Instruments. Crafted with precision and innovation, this product offers unparalleled quality and reliability that Texas Instruments is renowned for. Perfect for a wide range of applications, this digital-to-analog converter guarantees seamless performance and accuracy. Experience the value of superior engineering and efficiency with the TLC7524CNSG4, designed to exceed expectations and deliver exceptional results every time.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

High maximum analog output voltage allows for a wide range of output signals, making this product suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, enhancing the overall reliability of the product.

No. of Bits: 8

Having 8 bits allows for a resolution of 256 discrete output levels, providing accurate and precise analog conversion.

Maximum Linearity Error (EL): 0.1953 %

Low linearity error ensures that the output signal closely follows the input signal, leading to high accuracy in analog conversion.

Nominal Settling Time (tstl): 0.1 us

Fast settling time ensures rapid response to changes in the input signal, making this product ideal for applications requiring real-time analog conversion.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in various environmental conditions, making this product versatile for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance of the product.

Technical Specifications

Digital-to-Analog Converters TLC7524CNSG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

100 ns

Maximum Supply Current:

2 mA

Maximum Settling Time:

100 ns

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5/15 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

TLC7524CNSG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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