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TLC7226EDW

Texas Instruments

TLC7226EDW by Texas Instruments

TLC7226EDW by Texas Instruments is an 8-bit D/A converter with 4 functions, max analog output voltage of ±5 V, and settling time of 20 µs. It operates on a supply voltage range of ±15 V and is ideal for applications requiring precise analog signal generation in industrial automation and instrumentation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,673 parts In-Stock

1+ parts

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7,673

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Digiode

USA . 900 parts In-Stock

1+ parts

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$16.663

100+ parts

-

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547

$16.663

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Parana Technologies

USA . 840 parts In-Stock

1+ parts

$23.613

100+ parts

-

1k+ parts

$24.247

10k+ parts

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840

$23.613

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$24.247

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DigiPath Technology Company

USA . 472 parts In-Stock

1+ parts

$26.000

100+ parts

$23.920

1k+ parts

-

10k+ parts

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472

$26.000

$23.920

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ChromeModa Solutions

Germany . 1,390 parts In-Stock

1+ parts

$26.531

100+ parts

$21.755

1k+ parts

-

10k+ parts

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1,390

$26.531

$21.755

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IDEA Electronic Components Group

UK . 657 parts In-Stock

1+ parts

$26.531

100+ parts

$25.204

1k+ parts

$23.878

10k+ parts

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657

$26.531

$25.204

$23.878

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One Stop Electronics

USA . 1,371 parts In-Stock

1+ parts

$33.000

100+ parts

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1,371

$33.000

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Corphita

USA . 2,829 parts In-Stock

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2,829

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Overview

Experience unparalleled precision and reliability with the TLC7226EDW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital-to-Analog Converters that are perfect for a wide range of applications. With 8 bits of resolution and a maximum settling time of just 20 microseconds, this converter offers exceptional performance. Whether you're working on industrial automation, telecommunications, or audio equipment, the TLC7226EDW provides outstanding value and accuracy that will elevate your projects to the next level. Trust Texas Instruments for all your digital-to-analog conversion needs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5 V

High maximum analog output voltage allows for a wide range of signal levels to be accurately converted and output.

No. of Bits: 8

Having 8 bits ensures that the digital input can be converted with high precision into the analog output.

Maximum Settling Time: 20 us

Fast settling time of 20 microseconds ensures quick and accurate conversion from digital to analog signals.

Maximum Linearity Error (EL): 0.3906 %

Low linearity error ensures that the output signal closely matches the input digital signal.

Package Style (Meter): SMALL OUTLINE

Small outline package makes this converter compact and suitable for space-constrained applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it an efficient choice for digital-to-analog conversion.

Technical Specifications

Digital-to-Analog Converters TLC7226EDW attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.3906 %

Maximum Supply Current:

12 mA

Maximum Settling Time:

20 µs

No. of Bits:

8

No. of Functions:

4

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-5 V

Maximum Analog Output Voltage:

5 V

Power Supplies:

5/15,GND/-5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLC7226EDW Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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