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TLC7135CFN

Texas Instruments

TLC7135CFN by Texas Instruments

TLC7135CFN by Texas Instruments is a 4-bit ADC with 0.005% EL, +-5V supplies, and 2mA max supply current. Ideal for commercial applications, it features dual-slope conversion, BCD output code, and operates b/w 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,046 parts In-Stock

1+ parts

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6,046

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Digiode

USA . 3,349 parts In-Stock

1+ parts

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3,349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$8.672

100+ parts

-

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449

$8.672

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Parana Technologies

USA . 302 parts In-Stock

1+ parts

$11.004

100+ parts

-

1k+ parts

$11.466

10k+ parts

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302

$11.004

-

$11.466

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DigiPath Technology Company

USA . 2,005 parts In-Stock

1+ parts

$12.117

100+ parts

-

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2,005

$12.117

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ChromeModa Solutions

Germany . 3,479 parts In-Stock

1+ parts

$12.364

100+ parts

$10.138

1k+ parts

-

10k+ parts

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3,479

$12.364

$10.138

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IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$12.364

100+ parts

$11.746

1k+ parts

$11.128

10k+ parts

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721

$12.364

$11.746

$11.128

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One Stop Electronics

USA . 532 parts In-Stock

1+ parts

$28.000

100+ parts

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532

$28.000

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Corphita

USA . 886 parts In-Stock

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886

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Overview

Experience unparalleled precision and reliability with the TLC7135CFN Analog-to-Digital Converter by Texas Instruments. Known for their high-quality manufacturing standards, Texas Instruments delivers a cutting-edge solution for a wide range of applications. With its compact square package design and low power consumption, this chip carrier ADC offers exceptional value to customers seeking accurate and efficient data conversion. Trust Texas Instruments to provide top-of-the-line technology that meets your needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection for the internal components of the converter, ensuring long-term reliability.

No. of Bits: 4

Provides a moderate resolution for converting analog signals to digital, suitable for many applications that do not require high precision.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter efficient and reliable in operation.

Maximum Analog Input Voltage: 7.5 V

The high maximum analog input voltage allows for flexibility in signal input range, accommodating a wide variety of input signals.

Output Format: PARALLEL, WORD

The parallel output format provides fast data transmission, while the word format simplifies interfacing with other digital systems, enhancing usability.

Technical Specifications

Analog-to-Digital Converters TLC7135CFN attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

4

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary Coded Decimal

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.005 %

Electrical Specifications

Power Supplies:

±5 V

Minimum Analog Input Voltage:

-7.5 V

Maximum Analog Input Voltage:

7.5 V

Nominal Supply Voltage:

5 V

Nominal Negative Supply Voltage:

-5 V

Maximum Supply Current:

2 mA

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.453 in (11.5062 mm)

Length:

0.453 in (11.5062 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TLC7135CFN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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