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TLC7126CNP3

Texas Instruments

TLC7126CNP3 by Texas Instruments

TLC7126CNP3 by Texas Instruments is a 40-terminal A/D converter with 9V supply voltage, operating from 0 to 70°C. It features CMOS technology, OFFSET BINARY output code, and supports up to 2V analog input. Ideal for commercial applications requiring precise analog-to-digital conversion in a rectangular plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,030 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,030

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-

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Digiode

USA . 2,465 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,465

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 535 parts In-Stock

1+ parts

$4.519

100+ parts

-

1k+ parts

$4.964

10k+ parts

-

535

$4.519

-

$4.964

-

DigiPath Technology Company

USA . 125 parts In-Stock

1+ parts

$4.975

100+ parts

$4.577

1k+ parts

-

10k+ parts

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125

$4.975

$4.577

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ChromeModa Solutions

Germany . 5,540 parts In-Stock

1+ parts

$5.077

100+ parts

$4.163

1k+ parts

-

10k+ parts

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5,540

$5.077

$4.163

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IDEA Electronic Components Group

UK . 167 parts In-Stock

1+ parts

$5.077

100+ parts

-

1k+ parts

$4.569

10k+ parts

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167

$5.077

-

$4.569

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AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$18.385

100+ parts

-

1k+ parts

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10k+ parts

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362

$18.385

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One Stop Electronics

USA . 921 parts In-Stock

1+ parts

$23.000

100+ parts

-

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921

$23.000

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Corphita

USA . 1,691 parts In-Stock

1+ parts

-

100+ parts

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1,691

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Overview

Transform the way you convert analog signals with the TLC7126CNP3 by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers reliable Analog-to-Digital Converters that are perfect for a wide range of applications. From industrial automation to consumer electronics, this converter offers exceptional value and precision, making it a must-have for any project where accuracy is critical. Upgrade your design with the TLC7126CNP3 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Power Supplies (V): 9

A supply voltage of 9V ensures stable and reliable operation of the converter.

No. of Terminals: 40

With a high number of terminals, this converter can handle a wide range of input signals and configurations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for use in a variety of environments without overheating.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this converter efficient and reliable.

Technical Specifications

Analog-to-Digital Converters TLC7126CNP3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Electrical Specifications

Power Supplies:

9 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

9 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP40,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T40

Trade Compliance

TLC7126CNP3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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