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TLC7126CN

Texas Instruments

TLC7126CN by Texas Instruments

TLC7126CN by Texas Instruments is an Analog-to-Digital Converter with 40 terminals, operating at 0-70°C. It has a max analog input voltage of 2V and uses CMOS technology. Ideal for commercial applications requiring precise A/D conversion in a compact IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,057 parts In-Stock

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5,057

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Digiode

USA . 114 parts In-Stock

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114

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 529 parts In-Stock

1+ parts

$11.378

100+ parts

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529

$11.378

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Parana Technologies

USA . 1,687 parts In-Stock

1+ parts

$19.521

100+ parts

-

1k+ parts

$19.524

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1,687

$19.521

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$19.524

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DigiPath Technology Company

USA . 89 parts In-Stock

1+ parts

$21.495

100+ parts

$19.776

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89

$21.495

$19.776

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ChromeModa Solutions

Germany . 2,669 parts In-Stock

1+ parts

$21.934

100+ parts

$17.986

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2,669

$21.934

$17.986

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IDEA Electronic Components Group

UK . 1,824 parts In-Stock

1+ parts

$21.934

100+ parts

$20.837

1k+ parts

$19.741

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1,824

$21.934

$20.837

$19.741

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One Stop Electronics

USA . 1,507 parts In-Stock

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$34.000

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1,507

$34.000

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Corphita

USA . 116 parts In-Stock

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116

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Overview

Unlock a world of precision and reliability with the TLC7126CN Analog-to-Digital Converter by Texas Instruments. Crafted with quality materials, this innovative device offers unparalleled performance in a variety of applications. Whether you're designing medical equipment, industrial machinery, or consumer electronics, trust in Texas Instruments to deliver superior products that exceed expectations. Experience the value and benefits of the TLC7126CN today and elevate your projects to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and cost-effectiveness.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement on a circuit board.

Power Supplies (V): 9

Operating at 9V allows for compatibility with a wide range of power sources and systems.

No. of Terminals: 40

Having 40 terminals provides flexibility in connecting the converter to other components in the system.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance of the converter.

Maximum Operating Temperature: 70 °C

Being able to operate up to 70°C ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Operating from 0°C ensures the converter can function in cooler environments as well.

Temperature Grade: COMMERCIAL

This grade indicates that the converter is suitable for use in commercial applications.

Maximum Analog Input Voltage: 2 V

With a maximum input voltage of 2V, the converter can accurately convert analog signals within this range.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board.

Converter Type: A/D CONVERTER

This type of converter is essential for converting analog signals to digital data for processing.

Nominal Supply Voltage: 9 V

Operating at the nominal supply voltage of 9V ensures optimal performance and compatibility.

Output Bit Code: OFFSET BINARY

Offset binary encoding allows for precise representation of digital data, ensuring accurate conversion results.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54mm provides compatibility with standard spacing on circuit boards, making installation easier.

Technical Specifications

Analog-to-Digital Converters TLC7126CN attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Electrical Specifications

Power Supplies:

9 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

9 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP40,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T40

Qualified:

No

Trade Compliance

TLC7126CN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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