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TLC4502AMUB

Texas Instruments

TLC4502AMUB by Texas Instruments

TLC4502AMUB by Texas Instruments is a dual operational amplifier with low-offset and low-bias features. It operates on 5V supplies, offers high voltage gain of 200000, and has a unity gain bandwidth of 4700 kHz. Ideal for military-grade applications requiring precise signal amplification in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,480 parts In-Stock

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5,480

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Digiode

USA . 3,313 parts In-Stock

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3,313

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Distributors (Availability)

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Parana Technologies

USA . 760 parts In-Stock

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$1.961

100+ parts

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$2.494

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760

$1.961

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$2.494

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ChromeModa Solutions

Germany . 5,341 parts In-Stock

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$2.203

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$1.806

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$2.203

$1.806

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IDEA Electronic Components Group

UK . 1,421 parts In-Stock

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$2.203

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$1.983

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$1.983

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One Stop Electronics

USA . 1,362 parts In-Stock

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$5.410

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1,362

$5.410

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AZTECH Wire

Italy . 710 parts In-Stock

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$5.897

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710

$5.897

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Corphita

USA . 4,827 parts In-Stock

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Lixinc

USA . 3,973 parts In-Stock

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DigiPath Technology Company

USA . 2,048 parts In-Stock

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$1.986

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Microchip USA

USA . 1,858 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the Texas Instruments TLC4502AMUB operational amplifiers. Crafted with top-tier ceramic and glass-sealed materials, these op amps offer exceptional performance in a compact rectangular package. Perfect for military-grade applications, the TLC4502AMUB provides ultra-low bias current and offset voltage, ensuring accurate signal processing in extreme conditions. Trust Texas Instruments to deliver cutting-edge technology that meets the highest standards of quality and efficiency. Elevate your projects with the TLC4502AMUB and experience unmatched precision like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Maximum Input Offset Voltage: 50 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio helps in eliminating unwanted noise and interference for a cleaner output signal.

Maximum Supply Voltage Limit: 7 V

A higher supply voltage limit provides flexibility in power supply options and extends the operational range of the product.

Minimum Slew Rate: 1 V/us

Fast slew rate enables the amplifier to respond quickly to changes in input signals, making it suitable for dynamic applications.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product can withstand extreme conditions and operate reliably in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the product energy-efficient and suitable for high-impedance applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLC4502AMUB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Chooper Stab

Technology:

CMOS

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Minimum Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

50 uV

Minimum Voltage Gain:

200000

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.5 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

3 mA

Physical Characteristics

Length:

0.255 in (6.475 mm)

Width:

0.245 in (6.225 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

10

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Standards

JESD-30 Code:

R-GDFP-F10

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

DFP

Package Shape:

Package Style:

Flatpack

Package Equivalence Code:

FL10,.3

Trade Compliance

TLC4502AMUB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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