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TLC4501AIDRG4

Texas Instruments

TLC4501AIDRG4 by Texas Instruments

TLC4501AIDRG4 by Texas Instruments is an Operational Amplifier with 40uV Max Input Offset Voltage, 100dB Nominal CMRR, and 4700kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low-offset, low-bias, and chopper-stab architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,541 parts In-Stock

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4,541

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Digiode

USA . 1,326 parts In-Stock

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1,326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,431 parts In-Stock

1+ parts

$3.519

100+ parts

$326.798

1k+ parts

$3.167

10k+ parts

-

1,431

$3.519

$326.798

$3.167

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DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$3.875

100+ parts

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526

$3.875

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IDEA Electronic Components Group

UK . 1,889 parts In-Stock

1+ parts

$3.954

100+ parts

-

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$3.559

10k+ parts

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1,889

$3.954

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$3.559

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ChromeModa Solutions

Germany . 1,302 parts In-Stock

1+ parts

$3.954

100+ parts

$3.242

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1,302

$3.954

$3.242

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One Stop Electronics

USA . 1,628 parts In-Stock

1+ parts

$7.410

100+ parts

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1,628

$7.410

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$15.502

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639

$15.502

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Lixinc

USA . 6,715 parts In-Stock

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6,715

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Corphita

USA . 3,144 parts In-Stock

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3,144

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iodParts Technologies Inc.

India . 90 parts In-Stock

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90

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Overview

Experience superior performance and precision with the TLC4501AIDRG4 operational amplifier from Texas Instruments. Crafted with excellence, this high-quality component is ideal for a wide range of applications in automotive and industrial settings. With low-offset and low-bias features, this amplifier ensures reliable and accurate signal processing. Trust Texas Instruments for cutting-edge technology and elevate your projects with the TLC4501AIDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 40 uV

High accuracy in signal processing and minimal error in output.

Surface Mount: YES

Easy to mount on circuit boards and saves space.

Nominal Common Mode Reject Ratio: 100 dB

Effectively rejects common mode noise for a cleaner output signal.

Nominal Supply Voltage / Vsup (V): 5

Ideal voltage supply for a wide range of applications.

Frequency Compensation: YES

Stable operation and prevents oscillations in the output.

Technology: CMOS

Low power consumption and high input impedance for efficient operation.

Nominal Unity Gain Bandwidth: 4700 kHz

Wide bandwidth for high-frequency applications.

Architecture: CHOPPER-STAB

Provides stability and reduces input offset voltage drift.

Technical Specifications

Operational Amplifiers (Op Amps) TLC4501AIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Chooper Stab

Technology:

CMOS

Power Supply:

5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

4.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

40 uV

Minimum Voltage Gain:

200000

Nominal Slew Rate:

2.5 V/us

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC4501AIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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