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TLC354CPWRG4

Texas Instruments

TLC354CPWRG4 by Texas Instruments

TLC354CPWRG4 by Texas Instruments is a CMOS technology comparator with 6500uV max input offset voltage, 0.0006uA max average bias current, and 650ns nominal response time. Ideal for applications requiring fast response times and low power consumption in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,238 parts In-Stock

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Digiode

USA . 3,704 parts In-Stock

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3,704

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,214 parts In-Stock

1+ parts

$2.321

100+ parts

-

1k+ parts

$2.818

10k+ parts

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1,214

$2.321

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$2.818

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DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$2.556

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1,706

$2.556

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IDEA Electronic Components Group

UK . 2,065 parts In-Stock

1+ parts

$2.608

100+ parts

-

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$2.347

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2,065

$2.608

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$2.347

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ChromeModa Solutions

Germany . 985 parts In-Stock

1+ parts

$2.608

100+ parts

$2.139

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985

$2.608

$2.139

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One Stop Electronics

USA . 617 parts In-Stock

1+ parts

$3.410

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617

$3.410

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AZTECH Wire

Italy . 513 parts In-Stock

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$19.300

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513

$19.300

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Corphita

USA . 1,822 parts In-Stock

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Microchip USA

USA . 1,123 parts In-Stock

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Overview

Discover the TLC354CPWRG4 by Texas Instruments, a high-quality comparator that offers precision and reliability. Manufactured by industry leader Texas Instruments, this device is perfect for a wide range of applications. With its low bias current and fast response time, the TLC354CPWRG4 provides exceptional value to customers looking for superior performance in their circuits. Whether you're designing for commercial or industrial use, this comparator delivers the accuracy and efficiency you need. Upgrade your designs with the TLC354CPWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the comparator, making it a reliable choice for long-term use.

Maximum Input Offset Voltage: 6500 uV

The high input offset voltage ensures accurate and precise comparison of input signals, making this comparator suitable for applications requiring high level of precision.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Output Type: OPEN-DRAIN

The open-drain output type allows for easy interfacing with other components in the circuit, providing flexibility in design and operation.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the comparator energy-efficient and versatile.

Technical Specifications

Comparators TLC354CPWRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

20 nA

Operational Characteristics

Maximum Supply Current:

600 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

650 ns

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

TLC354CPWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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