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TLC3702IPWRG4

Texas Instruments

TLC3702IPWRG4 by Texas Instruments

TLC3702IPWRG4 by Texas Instruments is a CMOS comparator with 2 functions, 7000 uV max input offset voltage, and 0.002 uA max average bias current. Ideal for industrial applications requiring fast response time of 2700 ns, it operates b/w -40 to 85 °C with a supply voltage of 5V.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 21,810 parts In-Stock

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Vyrian

USA . 4,528 parts In-Stock

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Digiode

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Nova Conductors

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Semicontronic

India . 1,223 parts In-Stock

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$1.410

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$1.375

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$1.368

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Parana Technologies

USA . 1,047 parts In-Stock

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$3.067

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$3.582

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$3.067

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DigiPath Technology Company

USA . 213 parts In-Stock

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$3.377

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$3.107

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ChromeModa Solutions

Germany . 5,454 parts In-Stock

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$3.446

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$2.826

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IDEA Electronic Components Group

UK . 1,548 parts In-Stock

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AZTECH Wire

Italy . 509 parts In-Stock

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$5.735

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One Stop Electronics

USA . 605 parts In-Stock

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Corohmni

South Africa . 63 parts In-Stock

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Ampacity Inc.

Singapore . 428 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the Texas Instruments TLC3702IPWRG4, a high-quality comparator designed to meet your precise needs with precision and reliability. With Texas Instruments renowned reputation for excellence in manufacturing, this product offers exceptional performance in a compact package. Ideal for a wide range of applications, this comparator provides value and benefits that enhance your projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the TLC3702IPWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for long-term use.

Maximum Input Offset Voltage: 7000 uV

High precision in offset voltage ensures accurate signal processing.

Maximum Average Bias Current (IIB): 0.002 uA

Low bias current helps in minimizing power consumption.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Dual functions provide versatility and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level ensures compatibility with common power sources.

Power Supplies (V): 5

Stable power supply ensures consistent performance under varying conditions.

No. of Terminals: 8

Sufficient terminals for connecting to external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and thin profile offer space-saving advantages in compact applications.

Maximum Supply Voltage Limit: 18 V

Can handle higher supply voltages, providing a wider operational range.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, suitable for industrial environments.

Maximum Bias Current (IIB) @25°C: 0.00003 uA

Extremely low bias current ensures minimal interference with signal processing.

Output Type: PUSH-PULL

Offers both sourcing and sinking outputs for versatile applications.

Nominal Response Time: 2700 ns

Fast response time ensures quick processing of input signals.

Minimum Operating Temperature: -40 °C

Functions reliably in cold operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and connection options.

Maximum Seated Height: 1.2 mm

Low profile design for compact and space-constrained applications.

Width: 3 mm

Slim width allows for tight spacing in circuit board layout.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing processes.

Length: 4.4 mm

Compact length for fitting into tight spaces.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy surface mounting onto circuit boards.

Amplifier Type: COMPARATOR

Designed specifically for comparing input signals in various applications.

Maximum Supply Current: 0.04 mA

Low supply current for energy-efficient operation.

Packing Method: TR

Tape and reel packaging for convenient handling and automated assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise connections and compact design.

Technical Specifications

Comparators TLC3702IPWRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

7 mV

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

30 pA

Operational Characteristics

Maximum Supply Current:

40 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

2.7 µs

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLC3702IPWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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